フォロー
Raju Ahmed, Ph. D.
Raju Ahmed, Ph. D.
Sr R&D Engineer at Micron Technology
確認したメール アドレス: micron.com - ホームページ
タイトル
引用先
引用先
SEM and ESEM techniques used for analysis of asphalt binder and mixture: A state of the art review
M Mazumder, R Ahmed, AW Ali, SJ Lee
Construction and Building Materials 186, 313-329, 2018
1932018
Ni-Cu-Zn ferrite research: A brief review
MF Huq, DK Saha, R Ahmed, ZH Mahmood
Journal of Scientific Research 5 (2), 215-234, 2013
592013
Structure and Interface Analysis of Diamond on an AlGaN/GaN HEMT Utilizing an in Situ SiNx Interlayer Grown by MOCVD
A Siddique, R Ahmed, J Anderson, M Nazari, L Yates, S Graham, M Holtz, ...
ACS Applied Electronic Materials 1 (8), 1387-1399, 2019
442019
Integration of GaN and diamond using epitaxial lateral overgrowth
R Ahmed, A Siddique, J Anderson, C Gautam, M Holtz, E Piner
ACS applied materials & interfaces 12 (35), 39397-39404, 2020
292020
Weak ferromagnetism and temperature dependent dielectric properties of Zn0. 9Ni0. 1O diluted magnetic semiconductor
R Ahmed, ASM Moslehuddin, ZH Mahmood, AKMA Hossain
Materials Research Bulletin 63, 32-40, 2015
262015
Selective Area Deposition of Hot Filament CVD Diamond on 100 Mm MOCVD Grown AlGaN/GaN Wafers
R Ahmed, A Siddique, J Anderson, C Engdahl, M Holtz, E Piner
ACS Crystal Growth & Design 19 (2), 672-677, 2019
242019
Improved Electrical Properties of AlGaN/GaN High-Electron-Mobility Transistors by In Situ Tailoring the SiNx Passivation Layer
A Siddique, R Ahmed, J Anderson, M Holtz, EL Piner
ACS Applied Materials & Interfaces 13 (15), 18264-18273, 2021
212021
Rheological and Morphological Characterization of Styrene‐Isoprene‐Styrene (SIS) Modified Asphalt Binder
M Mazumder, A Siddique, R Ahmed, SJ Lee, MS Lee
Advances in Civil Engineering 2020 (1), 8877371, 2020
182020
Ultraviolet micro-Raman stress map of polycrystalline diamond grown selectively on silicon substrates using chemical vapor deposition
R Ahmed, M Nazari, BL Hancock, J Simpson, C Engdahl, EL Piner, ...
Applied Physics Letters 112 (18), 2018
182018
Spectroscopic Ellipsometry of Asphalt Binder: A Study of Optical Constants
M Mazumder, R Ahmed, M Hasan, SJ Lee, MS Lee
International Journal of Civil Engineering, 1-9, 2019
132019
Effect of reactant gas stoichiometry of in-situ SiNx passivation on structural properties of MOCVD AlGaN/GaN HEMTs
A Siddique, R Ahmed, J Anderson, EL Piner
Journal of Crystal Growth 517, 28-34, 2019
122019
Effect of precursor stoichiometry on morphology, phase purity, and texture formation of hot filament CVD diamond films grown on Si (100) substrate
R Ahmed, A Siddique, R Saha, J Anderson, C Engdahl, M Holtz, E Piner
Journal of Materials Science: Materials in Electronics, 2020
92020
Conductive interconnects and methods of forming conductive interconnects
R Ahmed, DA Kewley, D Pratt, YT Sung, F Speetjens, G Lugani
US Patent 11,328,749, 2022
32022
Optical characterization of asphalt binders containing wax additives
M Mazumder, R Ahmed, MS Lee, SJ Lee
Advances in Civil Engineering 2020 (1), 4170691, 2020
32020
HAADF-STEM study of filament material in hot filament CVD diamond films
J Anderson, R Ahmed, A Siddique, EL Piner
Microscopy and Microanalysis 25 (S2), 1788-1789, 2019
32019
Conductive interconnects and methods of forming conductive interconnects
R Ahmed, F Speetjens, DS Miller, SNS Chalamalasetty, D Pratt, Y Hu, ...
US Patent 11,545,391, 2023
12023
Methods for forming conductive vias, and associated devices and systems
TD Gawai, DS Pratt, AM Elsied, DA Kewley, DW Collins, R Ahmed, ...
US Patent 11,515,204, 2022
12022
Assemblies having Conductive Interconnects which are Laterally and Vertically Offset Relative to One Another
R Ahmed, R Kotti, DA Kewley, D Pratt
US Patent App. 18/652,079, 2024
2024
Methods for forming conductive vias, and associated devices and systems
TD Gawai, DS Pratt, AM Elsied, DA Kewley, DW Collins, R Ahmed, ...
US Patent App. 18/634,809, 2024
2024
Assemblies having conductive interconnects which are laterally and vertically offset relative to one another and methods of forming assemblies having conductive interconnects …
R Ahmed, R Kotti, DA Kewley, D Pratt
US Patent 12,014,983, 2024
2024
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