SEM and ESEM techniques used for analysis of asphalt binder and mixture: A state of the art review M Mazumder, R Ahmed, AW Ali, SJ Lee Construction and Building Materials 186, 313-329, 2018 | 193 | 2018 |
Ni-Cu-Zn ferrite research: A brief review MF Huq, DK Saha, R Ahmed, ZH Mahmood Journal of Scientific Research 5 (2), 215-234, 2013 | 59 | 2013 |
Structure and Interface Analysis of Diamond on an AlGaN/GaN HEMT Utilizing an in Situ SiNx Interlayer Grown by MOCVD A Siddique, R Ahmed, J Anderson, M Nazari, L Yates, S Graham, M Holtz, ... ACS Applied Electronic Materials 1 (8), 1387-1399, 2019 | 44 | 2019 |
Integration of GaN and diamond using epitaxial lateral overgrowth R Ahmed, A Siddique, J Anderson, C Gautam, M Holtz, E Piner ACS applied materials & interfaces 12 (35), 39397-39404, 2020 | 29 | 2020 |
Weak ferromagnetism and temperature dependent dielectric properties of Zn0. 9Ni0. 1O diluted magnetic semiconductor R Ahmed, ASM Moslehuddin, ZH Mahmood, AKMA Hossain Materials Research Bulletin 63, 32-40, 2015 | 26 | 2015 |
Selective Area Deposition of Hot Filament CVD Diamond on 100 Mm MOCVD Grown AlGaN/GaN Wafers R Ahmed, A Siddique, J Anderson, C Engdahl, M Holtz, E Piner ACS Crystal Growth & Design 19 (2), 672-677, 2019 | 24 | 2019 |
Improved Electrical Properties of AlGaN/GaN High-Electron-Mobility Transistors by In Situ Tailoring the SiNx Passivation Layer A Siddique, R Ahmed, J Anderson, M Holtz, EL Piner ACS Applied Materials & Interfaces 13 (15), 18264-18273, 2021 | 21 | 2021 |
Rheological and Morphological Characterization of Styrene‐Isoprene‐Styrene (SIS) Modified Asphalt Binder M Mazumder, A Siddique, R Ahmed, SJ Lee, MS Lee Advances in Civil Engineering 2020 (1), 8877371, 2020 | 18 | 2020 |
Ultraviolet micro-Raman stress map of polycrystalline diamond grown selectively on silicon substrates using chemical vapor deposition R Ahmed, M Nazari, BL Hancock, J Simpson, C Engdahl, EL Piner, ... Applied Physics Letters 112 (18), 2018 | 18 | 2018 |
Spectroscopic Ellipsometry of Asphalt Binder: A Study of Optical Constants M Mazumder, R Ahmed, M Hasan, SJ Lee, MS Lee International Journal of Civil Engineering, 1-9, 2019 | 13 | 2019 |
Effect of reactant gas stoichiometry of in-situ SiNx passivation on structural properties of MOCVD AlGaN/GaN HEMTs A Siddique, R Ahmed, J Anderson, EL Piner Journal of Crystal Growth 517, 28-34, 2019 | 12 | 2019 |
Effect of precursor stoichiometry on morphology, phase purity, and texture formation of hot filament CVD diamond films grown on Si (100) substrate R Ahmed, A Siddique, R Saha, J Anderson, C Engdahl, M Holtz, E Piner Journal of Materials Science: Materials in Electronics, 2020 | 9 | 2020 |
Conductive interconnects and methods of forming conductive interconnects R Ahmed, DA Kewley, D Pratt, YT Sung, F Speetjens, G Lugani US Patent 11,328,749, 2022 | 3 | 2022 |
Optical characterization of asphalt binders containing wax additives M Mazumder, R Ahmed, MS Lee, SJ Lee Advances in Civil Engineering 2020 (1), 4170691, 2020 | 3 | 2020 |
HAADF-STEM study of filament material in hot filament CVD diamond films J Anderson, R Ahmed, A Siddique, EL Piner Microscopy and Microanalysis 25 (S2), 1788-1789, 2019 | 3 | 2019 |
Conductive interconnects and methods of forming conductive interconnects R Ahmed, F Speetjens, DS Miller, SNS Chalamalasetty, D Pratt, Y Hu, ... US Patent 11,545,391, 2023 | 1 | 2023 |
Methods for forming conductive vias, and associated devices and systems TD Gawai, DS Pratt, AM Elsied, DA Kewley, DW Collins, R Ahmed, ... US Patent 11,515,204, 2022 | 1 | 2022 |
Assemblies having Conductive Interconnects which are Laterally and Vertically Offset Relative to One Another R Ahmed, R Kotti, DA Kewley, D Pratt US Patent App. 18/652,079, 2024 | | 2024 |
Methods for forming conductive vias, and associated devices and systems TD Gawai, DS Pratt, AM Elsied, DA Kewley, DW Collins, R Ahmed, ... US Patent App. 18/634,809, 2024 | | 2024 |
Assemblies having conductive interconnects which are laterally and vertically offset relative to one another and methods of forming assemblies having conductive interconnects … R Ahmed, R Kotti, DA Kewley, D Pratt US Patent 12,014,983, 2024 | | 2024 |