| Solder creep-fatigue analysis by an energy-partitioning approach A Dasgupta, C Oyan, D Barker, M Pecht | 301 | 1992 |
| Material failure mechanisms and damage models A Dasgupta, M Pecht IEEE Transactions on Reliability 40 (5), 531-536, 1991 | 287 | 1991 |
| Physics-of-failure: an approach to reliable product development M Pecht, A Dasgupta Journal of the IES 38 (5), 30-34, 1995 | 257 | 1995 |
| Three-dimensional modeling of woven-fabric composites for effective thermo-mechanical and thermal properties A Dasgupta, RK Agarwal, SM Bhandarkar Composites science and technology 56 (3), 209-223, 1996 | 252 | 1996 |
| Orthotropic thermal conductivity of plain-weave fabric composites using a homogenization technique A Dasgupta, RK Agarwal Journal of composite materials 26 (18), 2736-2758, 1992 | 205 | 1992 |
| Ultrasound-mediated drug delivery to the brain: principles, progress and prospects A Dasgupta, M Liu, T Ojha, G Storm, F Kiessling, T Lammers Drug Discovery Today: Technologies 20, 41-48, 2016 | 177 | 2016 |
| Role of failure-mechanism identification in accelerated testing J Hu, D Barker, A Dasgupta, A Arora Journal of the IES 36 (4), 39-45, 1993 | 148 | 1993 |
| Fibrosis imaging: current concepts and future directions M Baues, A Dasgupta, J Ehling, J Prakash, P Boor, F Tacke, F Kiessling, ... Advanced drug delivery reviews 121, 9-26, 2017 | 146 | 2017 |
| A fundamental overview of accelerated testing analytical models H Caruso, A Dasgupta Journal of the IEST 41 (1), 16-20, 1998 | 126 | 1998 |
| Failure-mechanism models for creep and creep rupture J Li, A Dasgupta IEEE Transactions on Reliability 42 (3), 339-353, 1993 | 118 | 1993 |
| Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3. 9Ag0. 6Cu solder alloy Q Zhang, A Dasgupta, P Haswell 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003 | 115 | 2003 |
| The reliability physics approach to failure prediction modelling M Pecht, A Dasgupta, D Barker, CT Leonard Quality and Reliability Engineering International 6 (4), 267-273, 1990 | 108 | 1990 |
| Quality conformance and qualification of microelectronic packages and interconnects MG Pecht, A Dasgupta, JW Evans, JY Evans John Wiley & Sons, 1994 | 107 | 1994 |
| Combined vibrational and thermal solder joint fatigue—A generalized strain versus life approach D Barker, J Vodzak, A Dasgupta, M Pecht | 105 | 1990 |
| PWB solder joint life calculations under thermal and vibrational loading D Barker, A Dasgupta, M Peeht Journal of the IES 35 (1), 17-25, 1992 | 103 | 1992 |
| Large-scale model test on square box culvert backfilled with sand A Dasgupta, B Sengupta Journal of Geotechnical Engineering 117 (1), 156-161, 1991 | 98 | 1991 |
| Systematic study on thermo-mechanical durability of Pb-free assemblies: Experiments and FE analysis Q Zhang, A Dasgupta, D Nelson, H Pallavicini | 88 | 2005 |
| PBCA-based polymeric microbubbles for molecular imaging and drug delivery P Koczera, L Appold, Y Shi, M Liu, A Dasgupta, V Pathak, T Ojha, ... Journal of controlled release 259, 128-135, 2017 | 87 | 2017 |
| Effective thermomechanical behavior of plain-weave fabric-reinforced composites using homogenization theory A Dasgupta, SM Bhandarkar | 87 | 1994 |
| Mechanistic model for the stress-strain response of double-layered PSA H Huang, A Dasgupta 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 85 | 2018 |
Ed HabtourThe University of Washington確認したメール アドレス: uw.edu
