オープン アクセスを義務付けられた論文 - Ki Wook Jung詳細
一般には非公開: 3 件
Busbar design for distributed DC-link capacitor banks for traction applications
R Alizadeh, M Schupbach, T Adamson, JC Balda, Y Zhao, S Long, ...
2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4810-4815, 2018
委任: US National Science Foundation
Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal
S Hazra, KW Jung, M Iyengar, C Malone, M Asheghi, KE Goodson
International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019
委任: Swiss National Science Foundation
Thermal modeling of single-phase and two-phase 2D-chip cooling using microchannels
CR Kharangate, H Lee, T Liu, KW Jung, MK Iyengar, C Malone, ...
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
委任: US National Science Foundation
一般公開: 12 件
Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance
KW Jung, CR Kharangate, H Lee, J Palko, F Zhou, M Asheghi, EM Dede, ...
International Journal of Heat and Mass Transfer 130, 1108-1119, 2019
委任: US National Science Foundation
Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution
T Liu, MT Dunham, KW Jung, B Chen, M Asheghi, KE Goodson
International Journal of Heat and Mass Transfer 152, 119569, 2020
委任: US National Science Foundation, US Department of Defense
Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa
D Kong, KW Jung, S Jung, D Jung, J Schaadt, M Iyengar, C Malone, ...
International Journal of Heat and Mass Transfer 141, 145-155, 2019
委任: US National Science Foundation
Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits
D Jung, H Lee, D Kong, E Cho, KW Jung, CR Kharangate, M Iyengar, ...
International Journal of Heat and Mass Transfer 175, 121192, 2021
委任: US National Science Foundation
Porous micropillar structures for retaining low surface tension liquids
DD Agonafer, H Lee, PA Vasquez, Y Won, KW Jung, S Lingamneni, B Ma, ...
Journal of colloid and interface science 514, 316-327, 2018
委任: US National Science Foundation, US Department of Defense
Experimental investigation of embedded micropin-fins for single-phase heat transfer and pressure drop
CR Kharangate, K Wook Jung, S Jung, D Kong, J Schaadt, M Iyengar, ...
Journal of Electronic Packaging 140 (2), 021001, 2018
委任: US National Science Foundation
Considerations and challenges for large area embedded micro-channels with 3D manifold in high heat flux power electronics applications
A Piazza, S Hazra, KW Jung, M Degner, MP Gupta, E Jih, M Asheghi, ...
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
委任: US National Science Foundation
Experimental study of single-phase cooling with DI water in an embedded microchannels-3D manifold cooler
KW Jung, F Zhou, M Asheghi, EM Dede, KE Goodson
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 164-166, 2019
委任: US National Science Foundation
Microfabrication Challenges for Silicon-based Large Area (>500 mm2) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal
S Hazra, A Piazza, KW Jung, M Asheghi, MP Gupta, E Jih, M Degner, ...
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
委任: US National Science Foundation, Swiss National Science Foundation, US …
Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-Based Thermal Management Devices
F Soroush, KW Jung, M Iyengar, C Malone, M Asheghi, K Goodson
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
委任: US National Science Foundation
Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm2) Power Electronics Cooling
KW Jung, S Hazra, H Kwon, A Piazza, E Jih, M Asheghi, MP Gupta, ...
International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019
委任: US National Science Foundation
Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa
KW Jung, H Lee, C Kharangate, F Zhou, M Asheghi, EM Dede, ...
International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019
委任: US National Science Foundation
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