| High lead solder (over 85%) solder in the electronics industry: RoHS exemptions and alternatives S Menon, E George, M Osterman, M Pecht Journal of Materials Science: Materials in Electronics 26, 4021-4030, 2015 | 104 | 2015 |
| Thermal cycling reliability of lead-free solders (SAC305 and Sn3. 5Ag) for high-temperature applications E George, D Das, M Osterman, M Pecht IEEE Transactions on Device and Materials Reliability 11 (2), 328-338, 2011 | 77 | 2011 |
| RoHS compliance in safety and reliability critical electronics E George, M Pecht Microelectronics Reliability 65, 1-7, 2016 | 52 | 2016 |
| Tin whisker analysis of an automotive engine control unit E George, M Pecht Microelectronics Reliability 54 (1), 214-219, 2014 | 30 | 2014 |
| iNEMI Pb-free alloy characterization project report: Part V–The effect of dwell time on thermal fatigue reliability R Coyle, R Parker, M Osterman, S Longgood, K Sweatman, E Benedetto, ... Proceedings of SMTAI 2013, 470-489, 2013 | 18 | 2013 |
| Physics-of-failure (PoF) methodology for electronic reliability C Hendricks, E George, M Osterman, M Pecht Reliability Characterisation of Electrical and Electronic Systems, 27-42, 2015 | 16 | 2015 |
| Thermal cycling reliability of alternative low-silver tin-based solders E George, M Osterman, M Pecht, R Coyle, R Parker, E Benedetto International Symposium on Microelectronics 2013 (1), 000120-000127, 2013 | 12 | 2013 |
| Effects of extended dwell time on thermal fatigue life of ceramic chip resistors E George, M Osterman, M Pecht, R Coyle International Symposium on Microelectronics 2012 (1), 000127-000135, 2012 | 10 | 2012 |
| Physics of failure based virtual testing of communications hardware E George, D Das, M Osterman, M Pecht, C Otte ASME International mechanical engineering congress and exposition 43789, 191-197, 2009 | 8 | 2009 |
| An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model E George, M Osterman, M Pecht Microelectronics Reliability 55 (3-4), 582-587, 2015 | 6 | 2015 |
| Thermal cycling reliability of alternative low-silver tin-based solders E George, M Osterman, M Pecht, R Coyle, R Parker, E Benedetto Journal of Microelectronics and Electronic Packaging 11 (4), 137-145, 2014 | 6 | 2014 |
| Fusion prognostics-based qualification of microelectronic devices M Pecht, E George, A Vasan, P Chauhan Proceedings of the 21th International Symposium on the Physical and Failure …, 2014 | 4 | 2014 |
| Physics-of-Failure (PoF) Methodology for Electronic,‖ C Hendricks, E George, M Osterman, M Pecht Reliability Characterisation of Electrical and Electronic Systems, 24-27, 2014 | 3 | 2014 |
| Experimental approach to determine damage curves for SnAgCu solder under sequential cyclic loads E George, DY Chen, M Osterman, M Pecht Journal of Electronic Materials 49, 1412-1420, 2020 | 2 | 2020 |
| A Lead-Free Transition Plan for Safety and Reliability Critical Products E George, M Pecht International Conference on challenges in IT, Engineering and Technology …, 2014 | 1 | 2014 |
| A NON-LINEAR DAMAGE MODEL WITH LOAD DEPENDENT EXPONENTS FOR SOLDERS UNDER SEQUENTIAL CYCLIC SHEAR LOADS E George | | 2015 |
| Thermal cycling reliability of lead-free solders (SAC305 and tin (3.5) silver) for high temperature applications E George University of Maryland, College Park, 2010 | | 2010 |
