| Integrated cooling (i-Cool) textile of heat conduction and sweat transportation for personal perspiration management Y Peng, W Li, B Liu, W Jin, J Schaadt, J Tang, G Zhou, G Wang, J Zhou, ... Nature communications 12 (1), 6122, 2021 | 133 | 2021 |
| Extreme two‐phase cooling from laser‐etched diamond and conformal, template‐fabricated microporous copper JW Palko, H Lee, C Zhang, TJ Dusseault, T Maitra, Y Won, DD Agonafer, ... Advanced Functional Materials 27 (45), 1703265, 2017 | 121 | 2017 |
| Quasi-ballistic electronic thermal conduction in metal inverse opals MT Barako, A Sood, C Zhang, J Wang, T Kodama, M Asheghi, X Zheng, ... Nano letters 16 (4), 2754-2761, 2016 | 100 | 2016 |
| Enhanced capillary‐fed boiling in copper inverse opals via template sintering C Zhang, JW Palko, MT Barako, M Asheghi, JG Santiago, KE Goodson Advanced Functional Materials 28 (41), 1803689, 2018 | 96 | 2018 |
| Approaching the limits of two-phase boiling heat transfer: High heat flux and low superheat JW Palko, C Zhang, JD Wilbur, TJ Dusseault, M Asheghi, KE Goodson, ... Applied Physics Letters 107 (25), 2015 | 81 | 2015 |
| High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply JW Palko, H Lee, DD Agonafer, C Zhang, KW Jung, J Moss, JD Wilbur, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 48 | 2016 |
| Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications C Zhang, JW Palko, MT Barako, M Asheghi, KE Goodson International Journal of Heat and Mass Transfer 173, 121241, 2021 | 31 | 2021 |
| Enhanced heat transfer using microporous copper inverse opals H Lee, T Maitra, J Palko, D Kong, C Zhang, MT Barako, Y Won, M Asheghi, ... Journal of Electronic Packaging 140 (2), 020906, 2018 | 28 | 2018 |
| Tailoring permeability of microporous copper structures through template sintering C Zhang, JW Palko, G Rong, KS Pringle, MT Barako, TJ Dusseault, ... ACS applied materials & interfaces 10 (36), 30487-30494, 2018 | 27 | 2018 |
| Tailoring of permeability in copper inverse opal for electronic cooling applications C Zhang, G Rong, JW Palko, TJ Dusseault, M Asheghi, JG Santiago, ... International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 15 | 2015 |
| Techno-economic feasibility analysis of an extreme heat flux micro-cooler EM Dede, C Zhang, Q Wu, N Seyedhassantehrani, M Shattique, S Roy, ... Iscience 26 (1), 2023 | 13 | 2023 |
| Characterization of the capillary performance of copper inverse opals C Zhang, S Lingamneni, MT Barako, JW Palko, M Asheghi, KE Goodson 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 11 | 2016 |
| Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications Q Wu, C Zhang, M Asheghi, K Goodson International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 8 | 2020 |
| A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling … S Hazra, C Zhang, Q Wu, M Asheghi, K Goodson, EM Dede, J Palko, ... Scientific reports 12 (1), 12180, 2022 | 7 | 2022 |
| A method for quantifying in plane permeability of porous thin films G Rong, JW Palko, DI Oyarzun, C Zhang, J Hämmerle, M Asheghi, ... Journal of colloid and interface science 530, 667-674, 2018 | 7 | 2018 |
| Copper inverse opal surfaces for enhanced boiling heat transfer H Lee, T Maitra, J Palko, C Zhang, M Barako, Y Won, M Asheghi, ... International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 7 | 2017 |
| A hybrid microporous copper structure for high performance capillary-driven liquid film boiling F Soroush, T Liu, Q Wu, C Zhang, M Asheghi, KE Goodson, L Marco, ... International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021 | 4 | 2021 |
| Thermal Management Research–from Power Electronics to Portables KW Jung, C Zhang, T Liu, M Asheghi, KE Goodson 2018 IEEE Symposium on VLSI Technology, 17-18, 2018 | 4 | 2018 |
| Heat flux micro coolers having multi-stepped features and fluid wicking C Zhang, Q Wu, M Shattique, N Seyedhassantehrani, S Roy, J Palko, ... US Patent 11,729,951, 2023 | 1 | 2023 |
| Bicontinuous Mesoporous Metal Foams with Enhanced Conductivity and Tunable Pore Size and Porosity via Electrodeposition for Electrochemical and Thermal Systems JS Katz, C Zhang, MT Barako, HJK Kim, M Asheghi, TW Kenny, ... ACS Applied Nano Materials 3 (12), 12408-12415, 2020 | 1 | 2020 |
Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial Professor確認したメール アドレス: stanford.edu