| Electronics manufacturing with lead-free JH Lau Halogen-free & Conductive-adhesive materials 17, 2003 | 345* | 2003 |
| Chip Scale Package (CSP): Design, Materials, Process, Reliability & Applications JH Lau, SWR Lee McGraw-Hill, 1999 | 286 | 1999 |
| Experimental investigations and model study of moisture behaviors in polymeric materials XJ Fan, SWR Lee, Q Han Microelectronics Reliability 49 (8), 861-871, 2009 | 208 | 2009 |
| Dynamic penetration of graphite/epoxy laminates impacted by a blunt-ended projectile SWR Lee, CT Sun Composites Science and Technology 49 (4), 369-380, 1993 | 185 | 1993 |
| Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers HS Lau, SW Lee, MMF Yuen, J Wu, CC Lo, H Fan, H Chen US Patent 8,604,603, 2013 | 107 | 2013 |
| Characterization and analysis on the solder ball shear testing conditions X Huang, SWR Lee, CC Yan, S Hui 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat …, 2001 | 106 | 2001 |
| Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants JH Lau, SWR Lee, C Chang, C Ouyang 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat …, 1999 | 100 | 1999 |
| Design, materials, process, fabrication, and reliability of fan-out wafer-level packaging JH Lau, M Li, QM Li, I Xu, T Chen, Z Li, KH Tan, QX Yong, Z Cheng, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (6 …, 2018 | 95 | 2018 |
| Fan-out wafer-level packaging for heterogeneous integration JH Lau, M Li, ML Qingqian, T Chen, I Xu, QX Yong, Z Cheng, N Fan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 94 | 2018 |
| Microvias for Low-Cost High-Density Interconnects J Lau, SW Lee McGraw-Hill, New York, NY, 2001 | 94 | 2001 |
| High-speed solder ball shear and pull tests vs. board level mechanical drop tests: correlation of failure mode and loading speed F Song, SWR Lee, K Newman, B Sykes, S Clark 2007 Proceedings 57th Electronic Components and Technology Conference, 1504-1513, 2007 | 91 | 2007 |
| A quasi-static penetration model for composite laminates SWR Lee, CT Sun Journal of Composite Materials 27 (3), 251-271, 1993 | 91 | 1993 |
| 3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling SWR Lee, R Hon, SXD Zhang, CK Wong Proceedings Electronic Components and Technology, 2005. ECTC'05., 795-801, 2005 | 89 | 2005 |
| Modeling and analysis of 96.5 Sn-3.5 Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board JH Lau, SWR Lee IEEE Transactions on Electronics Packaging Manufacturing 25 (1), 51-58, 2002 | 85 | 2002 |
| Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP) JH Lau, SWR Lee IEEE transactions on components and packaging technologies 25 (1), 3-14, 2002 | 83 | 2002 |
| Investigation of IMC thickness effect on the lead-free solder ball attachment strength: comparison between ball shear test and cold bump pull test results F Song, SWR Lee 56th Electronic Components and Technology Conference 2006, 8 pp., 2006 | 80 | 2006 |
| 3D LED and IC wafer level packaging J Lau, R Lee, M Yuen, P Chan Microelectronics International 27 (2), 98-105, 2010 | 78 | 2010 |
| Multistack flip chip 3D packaging with copper plated through-silicon vertical interconnection R Hon, SWR Lee, SX Zhang, CK Wong 2005 7th Electronic Packaging Technology Conference 2, 6 pp., 2005 | 77 | 2005 |
| Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests F Song, SWR Lee, K Newman, B Sykes, S Clark 2007 Proceedings 57th Electronic Components and Technology Conference, 364-372, 2007 | 76 | 2007 |
| Charge‐transfer complexes and their role in exciplex emission and near‐infrared photovoltaics TW Ng, MF Lo, MK Fung, WJ Zhang, CS Lee Advanced Materials 26 (31), 5569-5574, 2014 | 73 | 2014 |
Jeffery C. C. LoHKUST Foshan Research Institute for Smart Manufacturing確認したメール アドレス: ust.hk