A review of 5G front-end systems package integration AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020
212 2020 First demonstration of compact, ultra-thin low-pass and bandpass filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ...
IEEE Microwave and Wireless Components Letters 28 (12), 1110-1112, 2018
73 2018 Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ...
IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020
69 2020 Broadband and miniaturized antenna-in-package (AiP) design for 5G applications TH Lin, K Kanno, AO Watanabe, PM Raj, RR Tummala, M Swaminathan, ...
IEEE Antennas and Wireless Propagation Letters 19 (11), 1963-1967, 2020
50 2020 Characterization of ABF/glass/ABF substrates for mmWave applications M ur Rehman, S Ravichandran, AO Watanabe, S Erdogan, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
43 2021 First demonstration of 28 GHz and 39 GHz transmission lines and antennas on glass substrates for 5G modules AO Watanabe, M Ali, B Tehrani, J Hester, H Matsuura, T Ogawa, PM Raj, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 236-241, 2017
43 2017 Glass-based IC-embedded antenna-integrated packages for 28-GHz high-speed data communications AO Watanabe, M Ali, R Zhang, S Ravichandran, T Kakutani, PM Raj, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 89-94, 2020
40 2020 Miniaturized high-performance filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1068-1075, 2018
38 2018 Leading-edge and ultra-thin 3D glass-polymer 5G modules with seamless antenna-to-transceiver signal transmissions A Watanabe, TH Lin, PM Raj, V Sundaram, MM Tentzeris, RR Tummala, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2026-2031, 2018
33 2018 Package-integrated, wideband power dividing networks and antenna arrays for 28-GHz 5G new radio bands M Ali, AO Watanabe, TH Lin, D Okamoto, MR Pulugurtha, MM Tentzeris, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
27 2020 Ultralow-loss substrate-integrated waveguides in glass-based substrates for millimeter-wave applications AO Watanabe, BK Tehrani, T Ogawa, PM Raj, MM Tentzeris, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
27 2020 Innovative Sub-5- F Liu, G Khurana, R Zhang, A Watanabe, BH DeProspo, C Nair, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019
23 2019 Highly-effective integrated EMI shields with graphene and nanomagnetic multilayered composites AO Watanabe, S Jeong, S Kim, Y Kim, J Min, D Wong, MR Pulugurtha, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 206-210, 2016
23 2016 Nanostructured miniaturized artificial magnetic conductors (AMC) for high-performance antennas in 5G, IoT, and smart skin applications TH Lin, PM Raj, A Watanabe, V Sundaram, R Tummala, MM Tentzeris
2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO), 911-915, 2017
22 2017 Advanced low-loss and high-density photosensitive dielectric material for RF/millimeter-wave applications H Ito, K Kanno, A Watanabe, R Tsuyuki, R Tatara, M Raj, RR Tummala
2019 International Wafer Level Packaging Conference (IWLPC), 1-6, 2019
21 2019 Advanced low loss dielectric material reliability and filter characteristics at high frequency for mmWave applications T Kakutani, D Okamoto, Z Guan, Y Suzuki, M Ali, A Watanabe, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 653-659, 2020
18 2020 Multilayered electromagnetic interference shielding structures for suppressing magnetic field coupling AO Watanabe, PM Raj, D Wong, R Mullapudi, R Tummala
Journal of Electronic Materials 47, 5243-5250, 2018
18 2018 Measurement and analysis of through glass via noise coupling and shielding structures in a glass interposer G Park, Y Kim, K Cho, J Park, I Hwang, J Kim, K Son, H Park, ...
IEEE Transactions on Electromagnetic Compatibility 63 (5), 1562-1573, 2021
17 2021 Sintered nanocopper paste for high-performance 3D heterogeneous package integration Y Wang, AO Watanabe, N Ogura, PM Raj, R Tummala
Journal of Electronic Materials 49, 6737-6745, 2020
17 2020 Interfacial spin-glass-like state in A Truong, AO Watanabe, PA Mortemousque, K Ando, T Sato, T Taniyama, ...
Physical Review B 91 (21), 214425, 2015
17 2015 
Rao Tummalaכתובת אימייל מאומתת בדומיין ece.gatech.edu