| The temperature-dependent structure, hydrogen bonding and other related dynamic properties of the standard TIP3P and CHARMM-modified TIP3P water models EES Ong, JL Liow Fluid Phase Equilibria 481, 55-65, 2019 | 62 | 2019 |
| Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation EES Ong, MZ Abdullah, CY Khor, WK Loh, CK Ooi, R Chan Microelectronic Engineering 113, 40-49, 2014 | 35 | 2014 |
| Yield stress measurement of a thixotropic colloid EES Ong, S O’Byrne, JL Liow Rheologica Acta 58, 383-401, 2019 | 33 | 2019 |
| Analysis of encapsulation process in 3D stacked chips with different microbump array EES Ong, MZ Abdullah, CY Khor, WK Loh, CK Ooi, R Chan International communications in heat and mass transfer 39 (10), 1616-1623, 2012 | 32 | 2012 |
| FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process EES Ong, MZ Abdullah, WK Loh, CK Ooi, R Chan Microelectronics Reliability 53 (4), 600-611, 2013 | 15 | 2013 |
| Study on the fluid–structure interaction of flexible printed circuit board electronics in the flow environment WC Leong, MZ Abdullah, CY Khor, EES Ong IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (8 …, 2012 | 12 | 2012 |
| Molecular dynamics study on the structural and dynamic properties of xanthan gum in a dilute solution under the effect of temperature EES Ong, S O’Byrne, JL Liow AIP conference proceedings 1954 (1), 2018 | 9 | 2018 |
| Numerical modeling and analysis of microbump pitch effect in 3d IC package with TSV during molded underfill (MUF) EES Ong, MZ Abdullah, CY Khor, WC Leong, WK Loh, CK Ooi, R Chan Engineering Applications of Computational Fluid Mechanics 7 (2), 210-222, 2013 | 9 | 2013 |
| The rheology and dynamic properties of biopolymers in a colloidal suspension EES Ong The University of New South Wales, 2019 | 1 | 2019 |
| Effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process WC Wong, CY Khor, EES Ong, MZ Abdullah, AA Saad, NM Yusop, ... 2012 7th International Microsystems, Packaging, Assembly and Circuits …, 2012 | 1 | 2012 |
| An attempt to measure the yield stress of microbial polysaccharides in aqueous solution EES Ong, JL Liow 89th Annual Meeting of the Society of Rheology, 2017 | | 2017 |
| Analysis of Plastic Encapsulation Process in 3D IC Package with Through-silicon Via (TSV) Technology EES Ong Universiti Sains Malaysia, 2013 | | 2013 |
Mohd Zulkfly AbdullahUniversiti Sains Malaysiaכתובת אימייל מאומתת בדומיין eng.usm.my