עקוב אחר
Syam Krishna
Syam Krishna
Czech Technical University in Prague, Czech Republic
אין אימייל מאומת
כותרת
צוטט על ידי
צוטט על ידי
שנה
The synergistic effect of advanced oxidation processes to eliminate resistant chemical compounds
M Horáková, Š Klementová, P Kříž, SK Balakrishna, P Špatenka, ...
Surface and Coatings Technology 241, 154-158, 2014
672014
Products and mechanism of verapamil removal in water by air non-thermal plasma treatment
S Krishna, E Ceriani, E Marotta, A Giardina, P Špatenka, C Paradisi
Chemical Engineering Journal 292, 35-41, 2016
532016
The influence of different parameters in tribological characteristics of pineapple/sisal/TiO2 filler incorporation
KR Sumesh, G Saikrishnan, P Pandiyan, L Prabhu, S Gokulkumar, ...
Journal of Industrial Textiles 51 (5_suppl), 8626S-8644S, 2022
432022
Degradation of Verapamil hydrochloride in water by gliding arc discharge
S Krishna, A Maslani, T Izdebski, M Horakova, S Klementova, P Spatenka
Chemosphere 152, 47-54, 2016
342016
Experimental investigation into the influence of plasma technology on seed surface wettability
P Kriz, P Olsan, Z Havelka, A Bohata, S Krishna, P Cerny, M Filip, ...
Applied Sciences 11 (21), 9994, 2021
92021
Plasma Treatment of Powders and Fibers
T Vacková, P Špatenka, S Balakrishna
Non-Thermal Plasma Technology for Polymeric Materials, 193-210, 2019
42019
Electrochemical polymerisation of aniline using natural rubber-coated platinum electrode
KR B.Syam Krishna, Arun S Prasad
Journal of elastomers and plastics 44 (3), 297-306, 2012
22012
Effect of Batio3 Nanofillers on the Bioactivity of Peek/Batio3 Nanocomposites
L Cvrček, S Krishna, J Knitlová, E Filová, M Buřil, J Walter, Z Jeníková, ...
SEVENTH INTERNATIONAL CONFERENCE ON MULTIFUNCTIONAL, HYBRID & NANOMATERIALS …, 0
Instant Journal of Mechanical Engineering
V Nováček, P Špatenka, T Vacková, Z Jeníková, S Krishna, B Veselý
המערכת אינה יכולה לבצע את הפעולה כעת. נסה שוב מאוחר יותר.
מאמרים 1–9