| Method of producing a thin layer of crystalline material A Ulyashin, A Usenko US Patent 6,806,171, 2004 | 279 | 2004 |
| Process for lift-off of a layer from a substrate AY Usenko US Patent 6,352,909, 2002 | 135 | 2002 |
| Process for manufacturing a silicon-on-insulator substrate and semiconductor devices on said substrate AY Usenko US Patent 6,368,938, 2002 | 99 | 2002 |
| Oxygen plasma conversion process for preparing a surface for bonding TK Chuang, A Usenko US Patent 8,557,679, 2013 | 97 | 2013 |
| Separation process for silicon-on-insulator wafer fabrication AY Usenko, WN Carr US Patent 6,387,829, 2002 | 75 | 2002 |
| Process for lift off and transfer of semiconductor devices onto an alien substrate AY Usenko, WN Carr US Patent 6,346,459, 2002 | 72 | 2002 |
| Method for forming a fragile layer inside of a single crystalline substrate preferably for making silicon-on-insulator wafers AY Usenko US Patent 7,148,124, 2006 | 56 | 2006 |
| Method for micro-mechanical structures A Usenko US Patent 6,344,417, 2002 | 41 | 2002 |
| Method for forming IC's comprising a highly-resistive or semi-insulating semiconductor substrate having a thin, low resistance active semiconductor layer thereon AY Usenko US Patent 6,355,493, 2002 | 36 | 2002 |
| Thinner silicon-on-insulator using plasma hydrogenation AY Usenko, AG Ulyashin Japanese journal of applied physics 41 (8R), 5021, 2002 | 29 | 2002 |
| Method of manufacture of a multi-layered substrate with a thin single crystalline layer and a versatile sacrificial layer W Carr, A Usenko US Patent 6,696,352, 2004 | 25 | 2004 |
| Semiconductor on glass substrate with stiffening layer and process of making the same NB Mohamed, TK Chuang, JS Cites, D Delprat, A Usenko US Patent 8,357,974, 2013 | 21 | 2013 |
| Silicon nitride surface conversion into oxide to enable hydrophilic bonding A Usenko, J Senawiratne ECS Transactions 33 (4), 475, 2010 | 18 | 2010 |
| Process for forming a fragile layer inside of a single crystalline substrate A Usenko US Patent 6,995,075, 2006 | 18 | 2006 |
| Methods for glass strengthening SE DeMartino, TH Elmer, A Usenko US Patent App. 14/091,607, 2014 | 16 | 2014 |
| Method for finishing silicon on insulator substrates A Usenko US Patent App. 13/805,143, 2013 | 14 | 2013 |
| SOI technology for MEMS applications AY Usenko, WN Carr Silicon-on-Insulator Technology and Devices IX: Proc. 9th Int. Symp., 347-352, 1999 | 12 | 1999 |
| Irradiation-then-anneal processing to improve BSIT performance AY Usenko IEEE transactions on electron devices 41 (6), 1055-1061, 1994 | 12 | 1994 |
| Handle substrate for use in manufacture of semiconductor-on-insulator structure and method of manufacturing thereof A Usenko US Patent 9,881,832, 2018 | 10 | 2018 |
| The study of the bonding energy on silicon-to-glass wafer bonding TK Chuang, A Usenko, J Cites ECS Transactions 33 (4), 501, 2010 | 10 | 2010 |
J. G. CouillardCorning Incorporatedכתובת אימייל מאומתת בדומיין corning.com