Stereolithography Resins with Conductive Fillers: An Effective Way to Enhance their Electrical Properties J Uřičář, J Minář 2021 44th International Spring Seminar on Electronics Technology (ISSE), 1-4, 2021 | 6 | 2021 |
Application of solid-phase microextraction arrows for characterizing volatile organic compounds from 3D printing of acrylonitrile-styrene-acrylate filament J Minář, D Pilnaj, J Uřičář, P Veselý, K Dušek Journal of Chromatography A 1705, 464180, 2023 | 4 | 2023 |
Thermal stability of valuable metals in lithium-ion battery cathode materials: Temperature range 100–400° C N Klusoňová, E Sedláčková, J Kočí, D Pilnaj, K Pánová, J Uřičář, ... Journal of Power Sources 627, 235795, 2025 | 2 | 2025 |
Sustainability Challenges: The Circular Economy Dilemma in Lithium-Ion Battery Cell Electrochemical Discharging Processes A Pražanová, Z Plachý, J Uřičář, D Pilnaj, J Kočí, V Knap 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | 2 | 2024 |
Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type I Králová, D Pilnaj, O Pop-Georgievski, J Uřičář, P Veselý, M Klimtová, ... Applied Surface Science 668, 160447, 2024 | 1 | 2024 |
Degradation of nanofiber layers made of biobased polyamide 4 L Reinšteinová, V Benešová, J Uřičář, P Holec, J Brožek Polymer Degradation and Stability 225, 110794, 2024 | 1 | 2024 |
Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes K Dušek, P Veselý, D Bušek, D Froš, I Králová, M Klimtová, D Pilnaj, ... 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | 1 | 2024 |
Coupled Thermogravimetric Analysis-Potentiometric Titration for Complex Analysis of Poly (vinyl chloride) Thermal Stability J Uřičář, A Chodounská, V Benešová, J Brožek, R Kalousková ACS Measurement Science Au 5 (1), 70, 2025 | | 2025 |
Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis M Kozak, P Vesely, D Pilnaj, J Uricar, K Dusek Welding in the World, 2024 | | 2024 |
An Expired Solder Paste vs Fresh Solder Paste: Reliability and Sustainability in Electronics Manufacturing D Busek, J Uricar, D Pilnaj 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | | 2024 |
3D printing conductive pastes based on polystyrene/graphite composite J Uřičář, P Veselý, D Pilnaj, J Sedláček, J Brožek 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | | 2024 |
Analysis of Composite BiSn Solder Paste Doped by Titanium Dioxide Nanoparticles I Králová, V Babets, J Uřičář, YH Wong, MFM Sabri 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | | 2024 |