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- John BowersProfessor of Electrical and Computer Engineering, UCSBEmail verificata su ece.ucsb.edu
- Patrick AbrahamLynredEmail verificata su lynred.com
- Steven DenBaarsProfessor of Materials, University of California Santa BarbaraEmail verificata su engineering.ucsb.edu
- Dubravko BabicFaculty of electrical engineering and computing, University of Zagreb, CroatiaEmail verificata su fer.hr
- Ali ShakouriProfessor of Electrical and Computer Engineering, Purdue UniversityEmail verificata su purdue.edu
- E. Fred Schubert, Future Chips Conste...Rensselaer Polytechnic InstituteEmail verificata su rpi.edu
- Evelyn L. HuTarr Coyne Professor of Applied Physics and of Electrical EngineeringEmail verificata su seas.harvard.edu
- Adil KarimJohns Hopkins University, Applied Physics LaboratoryEmail verificata su jhuapl.edu
- Hans WenzelFerdinand-Braun-Institut, Humboldt-UniversitätEmail verificata su fbh-berlin.de
- Qi DaiProfessor, School of Information Science & Technology, Fudan UniversityEmail verificata su fudan.edu.cn
- Jong Kyu KimProfessor,POSTECHEmail verificata su postech.ac.kr
- L. A. ColdrenProf. of ECE, University of California, Santa BarbaraEmail verificata su ece.ucsb.edu
- Adrian KeatingThe University of Western AsutraliaEmail verificata su uwa.edu.au
- Martin F SchubertGoogleEmail verificata su google.com
- Jong-In ShimDept. of Electronics and Communication Eng., Hanyang University ERICA CampusEmail verificata su hanyang.ac.kr
- Richard MirinNISTEmail verificata su nist.gov
- Michael KneisslProfessor, Institute of Solid State Physics, TU Berlin, GermanyEmail verificata su physik.tu-berlin.de
- Robert M. FarrellAssistant Professor, ECE Department, University of Wisconsin–MadisonEmail verificata su wisc.edu
- Kenton WhiteUniversity of OttawaEmail verificata su uottawa.ca
- Jim SpeckProfessor of Materials, UCSBEmail verificata su ucsb.edu