| Structures and methods for integration of ultralow-k dielectrics with improved reliability SM Gates, S Nguyen US Patent 7,088,003, 2006 | 605 | 2006 |
| Multi component dielectric layer SM Gates, A Grill, S Van Nguyen, SV Nitta US Patent 8,357,608, 2013 | 555 | 2013 |
| Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made SM Gates, A Grill, DR Medeiros, D Neumayer, S Van Nguyen, VV Patel, ... US Patent 7,049,247, 2006 | 513 | 2006 |
| SiCOH dielectric A Afzali-Ardakani, S Gates, A Grill, D Neumayer, S Nguyen, V Patel US Patent App. 11/336,726, 2007 | 512 | 2007 |
| C-rich carbon boron nitride dielectric films for use in electronic devices S Van Nguyen, A Grill, TJ Haigh, S Mehta US Patent 8,476,743, 2013 | 359 | 2013 |
| Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art A Grill, SM Gates, TE Ryan, SV Nguyen, D Priyadarshini Applied Physics Reviews 1 (1), 2014 | 328 | 2014 |
| PECVD method of depositing fluorine doped oxide using a fluorine precursor containing a glass-forming element DM Dobuzinsky, T Matsuda, SV Nguyen, JG Ryan, M Shapiro US Patent 5,563,105, 1996 | 317 | 1996 |
| Biogenesis and structure of a type VI secretion membrane core complex E Durand, VS Nguyen, A Zoued, L Logger, G Péhau-Arnaudet, ... Nature 523 (7562), 555-560, 2015 | 290 | 2015 |
| Method of modifying interlayer adhesion FC Schmitt, LQ Xia, S Van Nguyen, S Venkataraman US Patent 6,913,992, 2005 | 258 | 2005 |
| Method for etching boron nitride SV Nguyen, DM Dobuzinsky US Patent 5,536,360, 1996 | 239 | 1996 |
| Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding SV Nguyen US Patent 8,546,956, 2013 | 206 | 2013 |
| Plasma-assisted chemical vapor deposition of dielectric thin films for ULSI semiconductor circuits DR Cote, SV Nguyen, AK Stamper, DS Armbrust, D Tobben, RA Conti, ... IBM Journal of research and development 43 (1.2), 5-38, 1999 | 203 | 1999 |
| Improving bug detection via context-based code representation learning and attention-based neural networks Y Li, S Wang, TN Nguyen, S Van Nguyen Proceedings of the ACM on Programming Languages 3 (OOPSLA), 1-30, 2019 | 192 | 2019 |
| Effects of titanium nanotubes on the osseointegration, cell differentiation, mineralisation and antibacterial properties of orthopaedic implant surfaces EP Su, DF Justin, CR Pratt, VK Sarin, VS Nguyen, S Oh, S Jin The bone & joint journal 100 (1_Supple_A), 9-16, 2018 | 140 | 2018 |
| High-density plasma chemical vapor deposition of silicon-based dielectric films for integrated circuits SV Nguyen IBM Journal of Research and development 43 (1.2), 109-126, 1999 | 134 | 1999 |
| Low K and ultra low K SiCOH dielectric films and methods to form the same SM Gates, CD Dimitrakopoulos, A Grill, S Van Nguyen US Patent 7,282,458, 2007 | 126 | 2007 |
| Plasma assisted chemical vapor deposited thin films for microelectronic applications SV Nguyen Journal of Vacuum Science & Technology B: Microelectronics Processing and …, 1986 | 124 | 1986 |
| Reaction Mechanisms of Plasma‐and Thermal‐Assisted Chemical Vapor Deposition of Tetraethylorthosilicate Oxide Films S Nguyen, D Dobuzinsky, D Harmon, R Gleason, S Fridmann Journal of The Electrochemical Society 137 (7), 2209, 1990 | 122 | 1990 |
| Low temperature plasma oxidation process DM Dobuzinsky, DL Harmon, SR Kasi, DM Kenney, S Van Nguyen, ... US Patent 5,330,935, 1994 | 115 | 1994 |
| Facile and scalable preparation of ruthenium oxide‐based flexible micro‐supercapacitors K Brousse, S Pinaud, S Nguyen, PF Fazzini, R Makarem, C Josse, ... Advanced Energy Materials 10 (6), 1903136, 2020 | 111 | 2020 |