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Fan Cai
Titolo
Citata da
Citata da
Anno
Low-loss 3-D multilayer transmission lines and interconnects fabricated by additive manufacturing technologies
F Cai, YH Chang, K Wang, C Zhang, B Wang, J Papapolymerou
IEEE Transactions on Microwave Theory and Techniques 64 (10), 3208-3216, 2016
1062016
Aerosol jet printing for 3-D multilayer passive microwave circuitry
F Cai, S Pavlidis, J Papapolymerou, YH Chang, K Wang, C Zhang, ...
2014 44th European Microwave Conference, 512-515, 2014
882014
High resolution aerosol jet printing of D-band printed transmission lines on flexible LCP substrate
F Cai, Y Chang, K Wang, WT Khan, S Pavlidis, J Papapolymerou
2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-3, 2014
692014
A study on 3D-printed coplanar waveguide with meshed and finite ground planes
EA Rojas-Nastrucci, T Weller, VL Aida, F Cai, J Papapolymerou
WAMICON 2014, 1-3, 2014
412014
A low loss X-band filter using 3-D polyjet technology
F Cai, WT Khan, J Papapolymerou
2015 IEEE MTT-S International Microwave Symposium, 1-4, 2015
392015
Self-powered smart meter with synchronized data
F Cai, E Farantatos, R Huang, APS Meliopoulos, J Papapolymerou
2012 IEEE Radio and Wireless Symposium, 395-398, 2012
192012
Self-powered advanced meter design for smart grid
F Cai, DJ Chung, E Farantatos, APS Meliopoulos, J Papapolymerou
2010 Asia-Pacific Microwave Conference, 1380-1383, 2010
10*2010
Novel stretchable electrically conductive composites for tunable RF devices
F Cai, Z Li, JC Agar, CP Wong, J Papapolymerou
2012 IEEE/MTT-S International Microwave Symposium Digest, 1-3, 2012
82012
Methods and systems for using distributed energy resources in an electric network
AP Meliopoulos, R Huang, F Cai, E Farantatos, RD Gill
US Patent App. 14/100,418, 2015
72015
2.4 GHz low cost low noise amplifier on flexible organic substrate
F Cai, AÇ Ulusoy, J Papapolymerou
2013 Asia-Pacific Microwave Conference Proceedings (APMC), 270-272, 2013
62013
John Papapolymerou.“
F Cai, WT Khan
A Low Loss X-band Filter Using, 1-4, 2010
52010
DEVELOPMENT OF 3D RF MICROSYSTEMS USING ADDITIVE MANUFACTRUING TECHNOLOGY
F Cai
Georgia Institute of Technology, 2016
2016
Stretchable/printed RF devices via high-throughput, high-definability soft-lithography fabrication
Z Li, L Li, K Moon, F Cai, J Papapolymerous, CP Wong
2013 IEEE 63rd Electronic Components and Technology Conference, 2332-2336, 2013
2013
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
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