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- Dimitrios PeroulisPurdue UniversityEmail verificata su purdue.edu
- Qun Jane GuGeorgia Institute of TechnologyEmail verificata su gatech.edu
- Yingsong LiAnhui UniversityEmail verificata su hrbeu.edu.cn
- Yuhao LiuChangzhou ChemsemiEmail verificata su chemsemi.com
- Bo YuUC DavisEmail verificata su ucdavis.edu
- Linda KatehiThe O'Donnell Professor of Engineering, Texas A&M University, College StationEmail verificata su tamu.edu
- Xiaohu WuSouthern University of Science and TechnologyEmail verificata su ieee.org
- J. Sebastián Gómez-DíazProfessor, University of California, DavisEmail verificata su ucdavis.edu
- Yu YeAppleEmail verificata su ucdavis.edu
- Alejandro Alvarez MelcónProfessor Telecommunication Engineering, Technical University CartagenaEmail verificata su upct.es
- Xiaonan JiangQualcomm Inc.Email verificata su ucdavis.edu
- Md Naimul HasanRFIC Design, Qualcomm Inc.Email verificata su ucdavis.edu
- Jingjun ChenQualcomm AtherosEmail verificata su qti.qualcomm.com
- Hao WangUniversity of California DavisEmail verificata su ucdavis.edu
- Xuan DingSkyworks | University of California, DavisEmail verificata su ucdavis.edu
- Songjie BiUC DavisEmail verificata su ucdavis.edu
- Kenle ChenUniversity of Central FloridaEmail verificata su ucf.edu
- Xiaomeng GaoAnalog DevicesEmail verificata su analog.com
- Dashuai WangSouthern University of Science and TechnologyEmail verificata su sustech.edu.cn
- Hjalti H. SigmarssonUniversity of OklahomaEmail verificata su ou.edu