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- Jason KenneyApplied MaterialsEmail verificata su amat.com
- Ken CollinsMaster, VP and Fellow at Applied MaterialsEmail verificata su amat.com
- Mark J. KushnerUniversity of MichiganEmail verificata su umich.edu
- Leonid DorfApplied MaterialsEmail verificata su amat.com
- Samer BannaTechnion, Israel Institute of Technology, Applied MaterialsEmail verificata su amat.com
- Mingfeng WuZenStone Venture CapitalEmail verificata su utexas.edu
- Jun-Chieh WangApplied Materials, University of MichiganEmail verificata su umich.edu
- Julian SchulzeProfessor (Ruhr-University Bochum)Email verificata su aept.rub.de
- Igor KaganovichPrinceton University, Princeton Plasma Physics LaboratoryEmail verificata su pppl.gov
- S. Samukawa, Seiji SamukawaInstitute of Fluid Science and Advanced Institute for Material Research, Tohoku UniversityEmail verificata su ifs.tohoku.ac.jp
- Thorsten LillClarycon Nanotechnology ResearchEmail verificata su claryconresearch.com
- Syed M. AlamEverspin Technologies, Inc.Email verificata su alum.mit.edu
- David R. BorisResearch Physicist, U. S. Naval Research LaboratoryEmail verificata su nrl.navy.mil
- Scott G WaltonNaval Research LaboratoryEmail verificata su nrl.navy.mil
- Prof. Dr. Marius OrlowskiVirginia Tech, Bradly Department of Electrical and Computer EngineeeringEmail verificata su vt.edu
- Ken HaraStanford UniversityEmail verificata su stanford.edu
- Aaron TheanNational University of SingaporeEmail verificata su nus.edu.sg
- Amr HaggagDistinguished Technical Staff, Corporate Quality, Freescale SemiconductorEmail verificata su freescale.com