| Wafer level 3-D ICs process technology CS Tan, RJ Gutmann, LR Reif Springer Science & Business Media, 2009 | 444 | 2009 |
| Method of forming a multi-layer semiconductor structure incorporating a processing handle member R Reif, KN Chen, CS Tan, A Fan US Patent 7,307,003, 2007 | 271 | 2007 |
| Technology, performance, and computer-aided design of three-dimensional integrated circuits S Das, A Fan, KN Chen, CS Tan, N Checka, R Reif Proceedings of the 2004 international symposium on Physical design, 108-115, 2004 | 208 | 2004 |
| Morphology and bond strength of copper wafer bonding KN Chen, CS Tan, A Fan, R Reif Electrochemical and Solid-State Letters 7 (1), G14, 2003 | 199 | 2003 |
| Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol CS Tan, DF Lim, SG Singh, SK Goulet, M Bergkvist Applied Physics Letters 95 (19), 2009 | 189 | 2009 |
| Low-threshold optically pumped lasing in highly strained germanium nanowires S Bao, D Kim, C Onwukaeme, S Gupta, K Saraswat, KH Lee, Y Kim, D Min, ... Nature Communications 8 (1), 1845, 2017 | 178 | 2017 |
| Microstructure evolution and abnormal grain growth during copper wafer bonding KN Chen, A Fan, CS Tan, R Reif, CY Wen Applied Physics Letters 81 (20), 3774-3776, 2002 | 129 | 2002 |
| Integration of III–V materials and Si-CMOS through double layer transfer process KH Lee, S Bao, E Fitzgerald, CS Tan Japanese Journal of Applied Physics 54 (3), 030209, 2015 | 102 | 2015 |
| Germanium-on-silicon nitride waveguides for mid-infrared integrated photonics W Li, P Anantha, S Bao, KH Lee, X Guo, T Hu, L Zhang, H Wang, R Soref, ... Applied physics letters 109 (24), 2016 | 99 | 2016 |
| Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration KN Chen, CS Tan, A Fan, R Reif Journal of Electronic Materials 34, 1464-1467, 2005 | 98 | 2005 |
| High-efficiency GeSn/Ge multiple-quantum-well photodetectors with photon-trapping microstructures operating at 2 µm H Zhou, S Xu, Y Lin, YC Huang, B Son, Q Chen, X Guo, KH Lee, SCK Goh, ... Optics express 28 (7), 10280-10293, 2020 | 93 | 2020 |
| Bonding parameters of blanket copper wafer bonding KN Chen, A Fan, CS Tan, R Reif Journal of electronic materials 35, 230-234, 2006 | 92 | 2006 |
| Silicon multilayer stacking based on copper wafer bonding CS Tan, R Reif Electrochemical and solid-state Letters 8 (6), G147, 2005 | 90 | 2005 |
| Contact resistance measurement of bonded copper interconnects for three-dimensional integration technology KN Chen, A Fan, CS Tan, R Reif IEEE Electron Device Letters 25 (1), 10-12, 2004 | 87 | 2004 |
| Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement CS Tan, DF Lim, XF Ang, J Wei, KC Leong Microelectronics Reliability 52 (2), 321-324, 2012 | 77 | 2012 |
| Low-temperature thermal oxide to plasma-enhanced chemical vapor deposition oxide wafer bonding for thin-film transfer application CS Tan, A Fan, KN Chen, R Reif Applied Physics Letters 82 (16), 2649-2651, 2003 | 77 | 2003 |
| Online condition monitoring system for DC-link capacitor in industrial power converters P Sundararajan, MHM Sathik, F Sasongko, CS Tan, M Tariq, ... IEEE Transactions on Industry Applications 54 (5), 4775-4785, 2018 | 76 | 2018 |
| Condition monitoring of DC-link capacitors using Goertzel algorithm for failure precursor parameter and temperature estimation P Sundararajan, MHM Sathik, F Sasongko, CS Tan, J Pou, F Blaabjerg, ... IEEE Transactions on Power Electronics 35 (6), 6386-6396, 2019 | 74 | 2019 |
| High-efficiency normal-incidence vertical pin photodetectors on a germanium-on-insulator platform Y Lin, KH Lee, S Bao, X Guo, H Wang, J Michel, CS Tan Photonics Research 5 (6), 702-709, 2017 | 74 | 2017 |
| Observation of interfacial void formation in bonded copper layers CS Tan, R Reif, ND Theodore, S Pozder Applied Physics Letters 87 (20), 2005 | 70 | 2005 |
