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- Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial ProfessorEmail verificata su stanford.edu
- H.-S. Philip WongProfessor of Electrical Engineering, Stanford UniversityEmail verificata su stanford.edu
- Feng XiongAssociate Professor, Department of Electrical and Computer Engineering, University of PittsburghEmail verificata su pitt.edu
- David EstradaBoise State University; Idaho National LaboratoryEmail verificata su boisestate.edu
- Myung-Ho BaeKorea Research Institute of Standards and Science, mhbae@kriss.re.krEmail verificata su kriss.re.kr
- Eilam YalonTechnion, Israel Institute of TechnologyEmail verificata su technion.ac.il
- Connor J. McClellanStanford UniversityEmail verificata su stanford.edu
- Ashkan BehnamDevice Engineer, MicronEmail verificata su micron.com
- Joseph W. LydingProfessor of Electrical and Computer Engineering, University of IllinoisEmail verificata su illinois.edu
- Krishna SaraswatProfessor of Electrical Engineering, Stanford UniversityEmail verificata su stanford.edu
- Albert LiaoEmerging Memory Engineer, MicronEmail verificata su micron.com
- Sanchit DeshmukhPhD, Stanford UniversityEmail verificata su alumni.stanford.edu
- Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, SingaporeEmail verificata su ihpc.a-star.edu.sg
- Dr. Miguel Muñoz Rojo - ERC granteeTenured permanent researcher (CSIC) & Associate Prof. (University of Twente)Email verificata su csic.es
- Hongjie DaiProfessor of chemistry, stanford universityEmail verificata su stanford.edu
- Joshua D. WoodPrincipal Solutions Engineer, DynatraceEmail verificata su dynatrace.com
- Saurabh V. SuryavanshiSynopsysEmail verificata su suryavanshi.me
- Asir Intisar KhanPostdoc, Materials Science, Lawrence Berkeley Lab | PhD, EE, Stanford UniversityEmail verificata su berkeley.edu
- Feifei LianStanford UniversityEmail verificata su stanford.edu
- Alwin DausInstitute of Semiconductor Engineering, University of StuttgartEmail verificata su iht.uni-stuttgart.de