Segui
Guy Cohen
Guy Cohen
Researcher, IBM T.J. Watson Research Center, Yorktown Height, New York
Email verificata su us.ibm.com
Titolo
Citata da
Citata da
Anno
High performance and highly uniform gate-all-around silicon nanowire MOSFETs with wire size dependent scaling
S Bangsaruntip, GM Cohen, A Majumdar, Y Zhang, SU Engelmann, ...
2009 IEEE International Electron Devices Meeting (IEDM), 1-4, 2009
6272009
Gate-all-around silicon nanowire 25-stage CMOS ring oscillators with diameter down to 3 nm
S Bangsaruntip, A Majumdar, GM Cohen, SU Engelmann, Y Zhang, ...
2010 symposium on VLSI technology, 21-22, 2010
3192010
Electrical integrity of state-of-the-art 0.13/spl mu/m SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
KW Guarini, AW Topol, M Ieong, R Yu, L Shi, MR Newport, DJ Frank, ...
Digest. International Electron Devices Meeting,, 943-945, 2002
2062002
Universality of short-channel effects in undoped-body silicon nanowire MOSFETs
S Bangsaruntip, GM Cohen, A Majumdar, JW Sleight
IEEE Electron Device Letters 31 (9), 903-905, 2010
1932010
Nanowire field-effect transistors
S Bangsaruntip, GM Cohen, KL Saenger
US Patent 7,795,677, 2010
1902010
Strained-channel Fin field effect transistor (FET) with a uniform channel thickness and separate gates
GM Cohen
US Patent 7,355,253, 2008
1732008
Method of forming vertical FET with nanowire channels and a silicided bottom contact
GM Cohen, PM Solomon
US Patent 7,446,025, 2008
1432008
Vertical FET with nanowire channels and a silicided bottom contact
GM Cohen, PM Solomon
US Patent 7,230,286, 2007
1262007
Process for forming a surrounding gate for a nanowire using a sacrificial patternable dielectric
S Bangsaruntip, G Cohen, MA Guillorn
US Patent 9,029,834, 2015
1252015
Density scaling with gate-all-around silicon nanowire MOSFETs for the 10 nm node and beyond
S Bangsaruntip, K Balakrishnan, SL Cheng, J Chang, M Brink, I Lauer, ...
2013 IEEE international electron devices meeting, 20.2. 1-20.2. 4, 2013
1242013
Strained-channel Fin field effect transistor (FET) with a uniform channel thickness and separate gates
GM Cohen
US Patent 7,384,830, 2008
1192008
Two gates are better than one [double-gate MOSFET process]
PM Solomon, KW Guarini, Y Zhang, K Chan, EC Jones, GM Cohen, ...
IEEE circuits and devices magazine 19 (1), 48-62, 2003
1162003
Maskless process for suspending and thinning nanowires
S Bangsaruntip, G Cohen, JW Sleight
US Patent 7,884,004, 2011
1152011
Mixed orientation and mixed material semiconductor-on-insulator wafer
GM Cohen, A Reznicek, KL Saenger, M Yang
US Patent 7,125,785, 2006
1152006
Self-aligned double-gate MOSFET by selective epitaxy and silicon wafer bonding techniques
KK Chan, GM Cohen, Y Taur, HSP Wong
US Patent 6,365,465, 2002
1062002
Triple-self-aligned, planar double-gate MOSFETs: devices and circuits
KW Guarini, PM Solomon, Y Zhang, KK Chan, EC Jones, GM Cohen, ...
International Electron Devices Meeting. Technical Digest (Cat. No. 01CH37224 …, 2001
1052001
Self-aligned silicide (salicide) process for low resistivity contacts to thin film silicon-on-insulator and bulk mosfets and for shallow junctions
C Cabral, K Chan, G Cohen, C Lavoie, R Roy, P Solomon
US Patent App. 10/989,639, 2006
1002006
Semiconductor-on-insulator lateral pin photodetector with a reflecting mirror and backside contact and method for forming the same
GM Cohen, K Rim, DL Rogers, JD Schaub, M Yang
US Patent 6,667,528, 2003
992003
Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures
AW Topol, BK Furman, KW Guarini, L Shi, GM Cohen, GF Walker
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
962004
Method and system for providing a quality metric for improved process control
D Kandel, G Cohen, D Klein, V Levinski, N Sapiens, A Shulman, ...
US Patent 11,372,340, 2022
882022
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
Articoli 1–20