Surface diffraction study of the hydrated hematite (11¯ 02) surface KS Tanwar, CS Lo, PJ Eng, JG Catalano, DA Walko, GE Brown Jr, ...
Surface Science 601 (2), 460-474, 2007
126 2007 Pb (II) adsorption on isostructural hydrated alumina and hematite (0001) surfaces: A DFT study SE Mason, CR Iceman, KS Tanwar, TP Trainor, AM Chaka
The Journal of Physical Chemistry C 113 (6), 2159-2170, 2009
123 2009 Density functional theory study of the clean and hydrated hematite CS Lo, KS Tanwar, AM Chaka, TP Trainor
Physical Review B—Condensed Matter and Materials Physics 75 (7), 075425, 2007
110 2007 Fe (II) adsorption on hematite (0 0 0 1) KS Tanwar, SC Petitto, SK Ghose, PJ Eng, TP Trainor
Geochimica et Cosmochimica Acta 73 (15), 4346-4365, 2009
80 2009 Hydrated α-Fe2O3 (11¯ 02) surface structure: Role of surface preparation KS Tanwar, JG Catalano, SC Petitto, SK Ghose, PJ Eng, TP Trainor
Surface science 601 (12), L59-L64, 2007
66 2007 Integrated circuits having magnetic tunnel junctions (MTJ) and methods for fabricating the same X Zhang, SX Lin, K Tanwar
US Patent 9,299,745, 2016
59 2016 BEOL Cu CMP process evaluation for advanced technology nodes K Tanwar, D Canaperi, M Lofaro, W Tseng, R Patlolla, C Penny, ...
Journal of The Electrochemical Society 160 (12), D3247, 2013
54 2013 Structural study of Fe (II) adsorption on hematite (11¯ 02) KS Tanwar, SC Petitto, SK Ghose, PJ Eng, TP Trainor
Geochimica et Cosmochimica Acta 72 (14), 3311-3325, 2008
49 2008 Methods for fabricating integrated circuits with ruthenium-lined copper K Tanwar, X Zhang, M He
US Patent 8,586,473, 2013
36 2013 Surface structure of magnetite (111) under hydrated conditions by crystal truncation rod diffraction SC Petitto, KS Tanwar, SK Ghose, PJ Eng, TP Trainor
Surface science 604 (13-14), 1082-1093, 2010
32 2010 CVD-Co/Cu (Mn) integration and reliability for 10 nm node T Nogami, M He, X Zhang, K Tanwar, R Patlolla, J Kelly, D Rath, ...
2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013
22 2013 Electromigration extendibility of Cu (Mn) alloy-seed interconnects, and understanding the fundamentals T Nogami, C Penny, A Madan, C Parks, J Li, P Flaitz, A Uedono, S Chiang, ...
2012 International Electron Devices Meeting, 33.7. 1-33.7. 4, 2012
20 2012 BEOL integration scheme for copper CMP to prevent dendrite formation K Tanwar
US Patent 8,669,176, 2014
11 2014 Surface structure and reactivity of iron oxide–water interfaces SK Ghose, SC Petitto, KS Tanwar, CS Lo, PJ Eng, AM Chaka, TP Trainor
Developments in Earth and Environmental Sciences 7, 1-29, 2007
11 2007 Methods for fabricating integrated circuits having embedded electrical interconnects ET Ryan, K Tanwar
US Patent 8,835,306, 2014
10 2014 Chapter 1 Surface Structure and Reactivity of Iron Oxide-Water Interfaces. Developments in Earth and Environmental Sciences SK Ghose, SC Petitto, KS Tanwar, CS Lo, PJ Eng, AM Chaka
Amsterdam, The Netherlands: Elsevier, 2007
9 2007 Moisture scavenging layer for thinner barrier application in beol integration M He, K Tanwar
US Patent 9,318,437, 2016
7 2016 Methods for fabricating integrated circuits using chemical mechanical planarization to recess metal K Tanwar, X Zhang, D Canaperi, R Patlolla
US Patent 9,275,874, 2016
7 2016 Performance of ultrathin alternative diffusion barrier metals for next-Generation BEOL technologies, and their effects on reliability T Nogami, M Chae, C Penny, T Shaw, H Shobha, J Li, S Cohen, CK Hu, ...
IEEE International Interconnect Technology Conference, 223-226, 2014
7 2014 W.-t. Tseng, R. Patlolla, C. Penny, and C. Waskiewicz K Tanwar, D Canaperi, M Lofaro
Journal of The Electrochemical Society 160 (12), D3247, 2013
6 2013 