Articoli con mandati relativi all'accesso pubblico - Kenneth E. GoodsonUlteriori informazioni
Non disponibili pubblicamente: 18
Thermal conduction in vertically aligned copper nanowire arrays and composites
MT Barako, S Roy-Panzer, TS English, T Kodama, M Asheghi, TW Kenny, ...
ACS applied materials & interfaces 7 (34), 19251-19259, 2015
Mandati: US Department of Energy
Busbar design for distributed DC-link capacitor banks for traction applications
R Alizadeh, M Schupbach, T Adamson, JC Balda, Y Zhao, S Long, ...
2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4810-4815, 2018
Mandati: US National Science Foundation
Thermal conductivity measurements on suspended diamond membranes using picosecond and femtosecond time-domain thermoreflectance
R Cheaito, A Sood, L Yates, TL Bougher, Z Cheng, M Asheghi, S Graham, ...
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
Mandati: US Department of Defense
Tunable, passive thermal regulation through liquid to vapor phase change
T Liu, JW Palko, JS Katz, EM Dede, F Zhou, M Asheghi, KE Goodson
Applied Physics Letters 115 (25), 2019
Mandati: US National Science Foundation
A compact 50-kW traction inverter design using off-the-shelf components
R Alizadeh, T Adamson, JC Balda, Y Zhao, M Asheghi, KE Goodson
2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 2614-2619, 2019
Mandati: US National Science Foundation
Multiobjective optimization of graded, hybrid micropillar wicks for capillary-fed evaporation
T Liu, M Asheghi, KE Goodson
Langmuir 38 (1), 221-230, 2021
Mandati: US National Science Foundation
Copper inverse opal surfaces for enhanced boiling heat transfer
H Lee, T Maitra, J Palko, C Zhang, M Barako, Y Won, M Asheghi, ...
International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017
Mandati: US National Science Foundation, US Department of Defense
A hybrid microporous copper structure for high performance capillary-driven liquid film boiling
F Soroush, T Liu, Q Wu, C Zhang, M Asheghi, KE Goodson, L Marco, ...
International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021
Mandati: US National Science Foundation
Development of a Hybrid Capillary-driven Single-phase and Two-phase Micro-cooler for Power Electronics Cooling
Y Lin, H Kwon, H Chen, MP Gupta, M Degner, M Asheghi, HA Mantooth, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024
Mandati: Swiss National Science Foundation
Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal
S Hazra, KW Jung, M Iyengar, C Malone, M Asheghi, KE Goodson
International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019
Mandati: Swiss National Science Foundation
Highly Anisotropic Thermal Conductivity in Spin-Cast Polystyrene Nano-Films
JS Katz, MT Barako, W Park, A Sood, M Asheghi, KE Goodson
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
Mandati: US National Science Foundation
Investigation of the heterogeneous thermal conductivity in bulk CVD diamond for use in electronics thermal management
L Yates, R Cheaito, A Sood, Z Cheng, T Bougher, M Asheghi, K Goodson, ...
International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017
Mandati: US National Science Foundation, US Department of Defense
Contact angle tuning of copper microporous structures
F Soroush, T Liu, Q Wu, M Asheghi, KE Goodson, L Marco, E Christian, ...
International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021
Mandati: US National Science Foundation, US Department of Energy
Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
S Singh, M Olyaei, K Jiang, Y Gurumukhi, K Goodson, M Asheghi, ...
International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023
Mandati: US National Science Foundation
Bicontinuous Mesoporous Metal Foams with Enhanced Conductivity and Tunable Pore Size and Porosity via Electrodeposition for Electrochemical and Thermal Systems
JS Katz, C Zhang, MT Barako, HJK Kim, M Asheghi, TW Kenny, ...
ACS Applied Nano Materials 3 (12), 12408-12415, 2020
Mandati: US National Science Foundation
Improving the performance of Ge
P Guo, JA Burrow, GA Sevison, A Sood, M Asheghi, JR Hendrickson, ...
Appl. Phys. Lett 113 (171903), 2018
Mandati: US National Science Foundation
Linking Interfacial Bonding and Thermal Conductivity in Molecularly‐Confined Polymer‐Glass Nanocomposites with Ultra‐High Interfacial Density
Y Wang, DW Collinson, H Kwon, RD Miller, K Lionti, KE Goodson, ...
Small 19 (28), 2301383, 2023
Mandati: US National Science Foundation, US Department of Defense
Thermal modeling of single-phase and two-phase 2D-chip cooling using microchannels
CR Kharangate, H Lee, T Liu, KW Jung, MK Iyengar, C Malone, ...
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
Mandati: US National Science Foundation
Disponibili pubblicamente: 94
Energy-efficient abundant-data computing: The N3XT 1,000 x
MMS Aly, M Gao, G Hills, CS Lee, G Pitner, MM Shulaker, TF Wu, ...
Computer 48 (12), 24-33, 2015
Mandati: Swiss National Science Foundation
Temperature-Dependent Thermal Boundary Conductance of Monolayer MoS2 by Raman Thermometry
E Yalon, B Aslan, KKH Smithe, CJ McClellan, SV Suryavanshi, F Xiong, ...
ACS applied materials & interfaces 9 (49), 43013-43020, 2017
Mandati: US National Science Foundation, US Department of Energy
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