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- Yunzhi WangProfessor of Materials Science and Engineering, Ohio State UniversityEmail verificata su osu.edu
- Yongfeng ZhangUniversity of Wisconsin-MadisonEmail verificata su wisc.edu
- Dong WangCenter for microstructure science, Xi'an Jiaotong UniversityEmail verificata su mail.xjtu.edu.cn
- Zhen-Ming Hua河北工业大学教授Email verificata su hebut.edu.cn
- Michael J. MillsThe Ohio State UniversityEmail verificata su osu.edu
- Jian GanIdaho National LaboratoryEmail verificata su inl.gov
- Chao JiangIdaho National LaboratoryEmail verificata su inl.gov
- Ronald NoebeNASA Glenn Research CenterEmail verificata su nasa.gov
- Rongpei ShiHarbin Institute of Technology (Shenzhen)Email verificata su hit.edu.cn
- Daniel SchwenIdaho National LaboratoryEmail verificata su schwen.de
- Yufeng ZhengAssociate Professor of Materials Science and Engineering, University of North TexasEmail verificata su unt.edu
- ning zhouCarpenter TechnologyEmail verificata su cartech.com
- Cheng SunAssociate Professor, Clemson UniversityEmail verificata su clemson.edu
- Lee CasalenaThermo Fisher ScientificEmail verificata su osu.edu
- jiaming zhuThe Hong Kong University of Science and TechnologyEmail verificata su connect.ust.hk
- Hamish FraserOhio State UniversityEmail verificata su osu.edu
- Larry AagesenComputational Scientist, Idaho National LaboratoryEmail verificata su inl.gov
- Matthew L. BowersNational Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National LaboratoryEmail verificata su lbl.gov
- Shenbao JinHebei University of TechnologyEmail verificata su hebut.edu.cn
- Gang ShaNanjing University of Science and TechnologyEmail verificata su njust.edu.cn