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- Kaifu HUOHuazhong University of Science and TechnologyEmail verificata su hust.edu.cn
- Ricky FuPlasma Technology Limited / City University of Hong KongEmail verificata su cityu.edu.hk
- Xuefeng Yu (喻学锋)Professor of Shenzhen Institutes of Advanced Technology, Chinese Academy of SciencesEmail verificata su siat.ac.cn
- Kelvin YeungDepartment of Orthopaedics and Traumatology, The University of Hong KongEmail verificata su hku.hk
- Shuilin WUPeking UniversityEmail verificata su pku.edu.cn
- Xuanyong LiuProfessor of Shanghai Institute of Ceramics, Chinese Academy of SciencesEmail verificata su mail.sic.ac.cn
- Huaiyu WangShenzhen Institutes of Advanced Technology, Chinese Academy of SciencesEmail verificata su siat.ac.cn
- Xuming Zhangwuhan university of science and technologyEmail verificata su wust.edu.cn
- Xiang PengWuhan Institute of TechnologyEmail verificata su wit.edu.cn
- Penghui LiShenzhen Institute of Advanced Technology, Chinese Academy of SciencesEmail verificata su siat.ac.cn
- Guosong WuProfessor, Hohai University, Nanjing, ChinaEmail verificata su hhu.edu.cn
- Kenneth M C CheungChair Professor, Department of Orthopaedics and Traumatology, University of Hong KongEmail verificata su hku.hk
- Jonathan C.Y. ChungDept. of Physics & Materials Science, City University of Hong KongEmail verificata su cityu.edu.hk
- Hao Huang (黄浩)Shenzhen Institute of Advanced Technology, Chinese Academy of SciencesEmail verificata su siat.ac.cn
- Tao HuApplied Materials Inc.Email verificata su amat.com
- Yongfeng MeiFudan UniversityEmail verificata su fudan.edu.cn
- Ang Gao (高昂)Associate Professor, Shenzhen Institute of Advanced Technology, Chinese Academy of SciencesEmail verificata su siat.ac.cn
- Weihong JinJinan UniversityEmail verificata su jnu.edu.cn
- Liangsheng HUShantou UniversityEmail verificata su stu.edu.cn
- Liuhe LiBeihang UniversityEmail verificata su buaa.edu.cn
Segui
Paul K Chu
Chair Professor of Materials Engineering, City University of Hong Kong
Email verificata su cityu.edu.hk - Home page