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- Hong JiangUniversity of Texas at ArlingtonEmail verificata su uta.edu
- Wen XiaHarbin Institute of Technology, ShenzhenEmail verificata su hit.edu.cn
- Xue (Steve) LiuFellow CAE; Fellow IEEE; Prof@McGill Univ.; VP R&D@Samsung AI; Chair ACM SIGBED; MilaEmail verificata su cs.mcgill.ca
- Min FuTencentEmail verificata su tencent.com
- Bin Xiao (肖斌)Fellow of IEEE, Fellow of AAIA, Professor of Dept. of Computing, HK Polytechnic Univ., 香港理工大学Email verificata su polyu.edu.hk
- Wenbo HeProfessor at Department of Computing and Software, McMaster UniversityEmail verificata su mcmaster.ca
- Xubin HeTemple UniversityEmail verificata su temple.edu
- Fred DouglisPeraton LabsEmail verificata su Peratonlabs.com
- Philip ShilaneDell TechnologiesEmail verificata su dell.com
- Yuan XieChair Professor of Hong Kong University of Science and Technology (HKUST)Email verificata su ust.hk
- Yiran ChenJohn Cocke Distinguished Professor of Electrical and Computer Engineering, Duke UniversityEmail verificata su duke.edu
- Ming ZhaoAssociate Professor, Arizona State UniversityEmail verificata su asu.edu
- Cong WangDepartment of Computer Science, City University of Hong KongEmail verificata su cityu.edu.hk
- Bharadwaj VeeravalliNUS, SingaporeEmail verificata su nus.edu.sg
- Song JiangUniversity of Texas, ArlingtonEmail verificata su uta.edu
- Jianping WangFellow of IEEE, Fellow of AAIA, Chair Professor, City University of Hong KongEmail verificata su cityu.edu.hk
- Jie LiuHarbin Institute of Technology (Shenzhen)Email verificata su hit.edu.cn