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Coautori
- Syed A. JafarChancellor's Professor of EECS, University of California IrvineEmail verificata su uci.edu
- Chenwei WangPrincipal Research Engineer, DOCOMO Innovations Inc., Palo Alto, CaliforniaEmail verificata su uci.edu
- Sae-Young ChungProfessor of Electrical Engineering, KAISTEmail verificata su kaist.ac.kr
- Sang-Woon JeonProfessor of Department of Electrical and Electronic Engineering, Hanyang UniversityEmail verificata su hanyang.ac.kr
- Hua SunAssociate Professor of EE, University of North TexasEmail verificata su unt.edu
- Toshiaki Koike-AkinoMERLEmail verificata su merl.com
- Claudio R. C. M. da SilvaReality Labs, MetaEmail verificata su ieee.org
- Philip OrlikDirector at Mitsubishi Electric Research LabsEmail verificata su merl.com
- Jungwon LeeExecutive Vice President, SamsungEmail verificata su samsung.com
- Man On PunThe Chinese University of Hong Kong (Shenzhen)Email verificata su alumni.usc.edu
- Chunhua GengMediaTek USA Inc., Bell Labs, UC IrvineEmail verificata su mediatek.com