Wafer-Scale Fabrication of Recessed-Channel PtSe2 MOSFETs With Low Contact Resistance and Improved Gate Control L Li, K Xiong, RJ Marsell, A Madjar, NC Strandwitz, JCM Hwang, ...
IEEE Transactions on Electron Devices 65 (10), 4102-4108, 2018
40 2018 BiCMOS embedded RF-MEMS switch for above 90 GHz applications using backside integration technique M Kaynak, M Wietstruck, R Scholz, J Drews, R Barth, KE Ehwald, A Fox, ...
2010 International Electron Devices Meeting, 36.5. 1-36.5. 4, 2010
39 2010 Development of a multi-project fan-out wafer level packaging platform T Braun, S Raatz, U Maass, M Van Dijk, H Walter, O Hölck, KF Becker, ...
2017 IEEE 67th electronic components and technology conference (ECTC), 1-7, 2017
36 2017 D–Band RF–MEMS SPDT Switch in a ST Wipf, A Göritz, M Wietstruck, C Wipf, B Tillack, M Kaynak
IEEE Microwave and Wireless Components Letters 26 (12), 1002-1004, 2016
34 2016 Substrate integrated waveguides for mm-wave functionalized silicon interposer M Bertrand, E Pistono, G Acri, D Kaddour, F Podevin, V Puyal, ST Wipf, ...
2018 IEEE/MTT-S International Microwave Symposium-IMS, 875-878, 2018
28 2018 Robustness and reliability of BiCMOS embedded RF-MEMS switch M Kaynak, F Korndörfer, M Wietstruck, D Knoll, R Scholz, C Wipf, ...
2011 IEEE 11th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2011
27 2011 CMOS-compatible batch processing of monolayer MoS2 MOSFETs K Xiong, H Kim, RJ Marstell, A Göritz, C Wipf, L Li, JH Park, X Luo, ...
Journal of Physics D: Applied Physics 51 (15), 15LT02, 2018
24 2018 Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads M Kaynak, M Wietstruck, W Zhang, J Drews, R Barth, D Knoll, ...
2012 IEEE/MTT-S International Microwave Symposium Digest, 1-3, 2012
23 2012 Large-Scale Fabrication of Submicrometer-Gate-Length MOSFETs With a Trilayer PtSe2 Channel Grown by Molecular Beam Epitaxy K Xiong, M Hilse, L Li, A Göritz, M Lisker, M Wietstruck, M Kaynak, ...
IEEE Transactions on Electron Devices 67 (3), 796-801, 2020
22 2020 A 125–143-GHz frequency-reconfigurable BiCMOS compact LNA using a single RF-MEMS switch J Heredia, M Ribó, L Pradell, ST Wipf, A Göritz, M Wietstruck, C Wipf, ...
IEEE Microwave and Wireless Components Letters 29 (5), 339-341, 2019
21 2019 A D-band SPDT switch utilizing reverse-saturated SiGe HBTs for dicke-radiometers B Cetindogan, B Ustundag, E Turkmen, M Wietstruck, M Kaynak, ...
2018 11th German Microwave Conference (GeMiC), 47-50, 2018
20 2018 Thin film wafer level encapsulated RF-MEMS switch for D-band applications ST Wipf, A Göritz, M Wietstruck, C Wipf, B Tillack, A Mai, M Kaynak
2016 11th European Microwave Integrated Circuits Conference (EuMIC), 452-455, 2016
20 2016 BiCMOS integrated microfluidic platform for Bio-MEMS applications M Kaynak, M Wietstruck, CB Kaynak, S Marschmeyer, P Kulse, K Schulz, ...
2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-3, 2014
18 2014 RF-MEMS switch module in a 0.25 μm BiCMOS technology M Kaynak, M Wietstruck, W Zhang, J Drews, R Scholz, D Knoll, ...
2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2012
18 2012 Experiments on MEMS integration in 0.25 μm CMOS process P Michalik, D Fernández, M Wietstruck, M Kaynak, J Madrenas
Sensors 18 (7), 2111, 2018
17 2018 Substrate integrated waveguide bandpass filters implemented on silicon interposer for terahertz applications G Prigent, AL Franc, M Wietstruck, M Keynak
2020 IEEE/MTT-S International Microwave Symposium (IMS), 595-598, 2020
16 2020 High Performance Thermistor Based on Si1−x Gex /Si Multi Quantum Wells CB Kaynak, Y Yamamoto, A Göritz, F Korndörfer, P Zaumseil, P Kulse, ...
IEEE Electron Device Letters 39 (5), 753-756, 2018
15 2018 Optimization of a BEOL aluminum deposition process enabling wafer level al-al thermo-compression bonding S Schulze, M Wietstruck, M Fraschke, P Kerepesi, H Kurz, B Rebhan, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 218-224, 2019
13 2019 BiCMOS integrated microfluidic packaging by wafer bonding for lab-on-chip applications M Inac, M Wietstruck, A Göritz, B Cetindogan, C Baristiran-Kaynak, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 786-791, 2017
13 2017 Modular integration of annular TSV structures filled with tungsten in a 0.25 μm SiGe: C BiCMOS technology S Marschmeyer, J Berthold, A Krüger, M Lisker, A Scheit, S Schulze, ...
Microelectronic Engineering 137, 153-157, 2015
13 2015 