Polymer-based 3-D printed Ku-band steerable phased-array antenna subsystem SH Shin, DF Alyasiri, M D’Auria, WJ Otter, CW Myant, D Stokes, Z Tian, ... IEEE Access 7, 106662-106673, 2019 | 29 | 2019 |
Microwave characterization of conductive PLA and its application to a 12 to 18 GHz 3-D printed rotary vane attenuator E Márquez-Segura, SH Shin, A Dawood, NM Ridler, S Lucyszyn IEEE Access 9, 84327-84343, 2021 | 19 | 2021 |
Polymer-based 3-D printed 140-220 GHz low-cost quasi-optical components and integrated subsystem assembly SH Shin, X Shang, NM Ridler, S Lucyszyn IEEE Access 9, 28020-28038, 2021 | 18 | 2021 |
3-D printing quantization predistortion applied to sub-THz chained-function filters L Zhu, R Payapulli, SH Shin, M Stanley, NM Ridler, S Lucyszyn IEEE Access 10, 38944-38963, 2022 | 14 | 2022 |
Polymer-based 3-D printed 140 to 220 GHz metal waveguide thru lines, twist and filters R Payapulli, L Zhu, SH Shin, M Stanley, NM Ridler, S Lucyszyn IEEE Access 11, 32272-32295, 2023 | 8 | 2023 |
3-D printed rectangular waveguide 123–129 GHz packaging for commercial CMOS RFICs L Zhu, SH Shin, R Payapulli, T Machii, M Motoyoshi, N Suematsu, ... IEEE Microwave and Wireless Technology Letters 33 (2), 157-160, 2023 | 8 | 2023 |
Benchmarking a commercial (sub-) THz focal plane array against a custom-built millimeter-wave single-pixel camera SH Shin, S Lucyszyn IEEE Access 8, 191174-191190, 2020 | 8 | 2020 |
Broadband coaxial S-parameter measurements for cryogenic quantum technologies SH Shin, M Stanley, J Skinner, SE de Graaf, NM Ridler IEEE Transactions on Microwave Theory and Techniques, 2023 | 6 | 2023 |
3-D Printed W-Band Waveguide Twist With Integrated Filtering L Zhu, IW Rossuck, R Payapulli, SH Shin, S Lucyszyn IEEE Microwave and Wireless Technology Letters 33 (6), 659-662, 2023 | 6 | 2023 |
3-D printed plug and play prototyping for low-cost sub-THz subsystems SH Shin, R Payapulli, L Zhu, M Stanley, X Shang, NM Ridler, S Lucyszyn IEEE Access 10, 41708-41719, 2022 | 6 | 2022 |
Enhanced cognitive demodulation with artificial intelligence H Ren, SH Shin, S Lucyszyn Scientific Reports 10 (1), 20298, 2020 | 6 | 2020 |
Characterising scattering parameters of coaxial microwave devices at milli-kelvin temperatures for quantum computing technologies M Stanley, SH Shin, J Skinner, J Urbonas, N Ridler 2023 53rd European Microwave Conference (EuMC), 150-153, 2023 | 5 | 2023 |
3-D Printed THz Waveguide Components L Zhu, SH Shin, R Payapulli, IW Rossuck, N Klein, NM Ridler, S Lucyszyn IEEE Access, 2023 | 3 | 2023 |
RF and microwave metrology for quantum computing–recent developments at the UK’s National Physical Laboratory M Stanley, X Shang, M Celep, M Salter, S de Graaf, T Lindstrom, SH Shin, ... International Journal of Microwave and Wireless Technologies, 1-9, 2024 | 1 | 2024 |
Fully 3-D printed tunable microwave subsystem SH Shin, D Alyasiri, M D’Auria, WJ Otter, CW Myant, D Stokes, Z Tian, ... 2019 IEEE MTT-S International Microwave Workshop Series on Advanced …, 2019 | 1 | 2019 |
In-operando microwave scattering-parameter calibrated measurement of a Josephson travelling wave parametric amplifier SH Shin, M Stanley, WN Wong, T Sweetnam, A Elarabi, T Lindström, ... Applied Physics Letter 125 (10), 2024 | | 2024 |
Application of Weighting Algorithm for Enhanced Broadband Vector Network Analyzer Measurements S Shin, J Skinner Mathematics 12 (18), 2871, 2024 | | 2024 |
SI Traceable RF and Microwave Power Measurements at Cryogenic Temperatures M Celep, SH Shin, M Stanley, E Breakenridge, S Singh, N Ridler 2024 Conference on Precision Electromagnetic Measurements (CPEM), 1-2, 2024 | | 2024 |
Characterizing S-Parameters of Microwave Coaxial Devices with up to Four Ports at Temperatures of 3 K and Above for Quantum Computing Applications M Stanley, M Salter, J Urbonas, J Skinner, S Shin, SE De Graaf, ... IEEE Transactions on Instrumentation and Measurement, 2024 | | 2024 |
[Special] RF Measurements for Quantum Computing Technologies N Ridler, X Shang, SH Shin, M Stanley IEICE Proceedings Series 73 (TH3-F6-1), 2022 | | 2022 |