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Debbie G. Senesky, Ph.D.
Debbie G. Senesky, Ph.D.
Associate Professor, Stanford University
Email verificata su stanford.edu - Home page
Titolo
Citata da
Citata da
Anno
Harsh environment silicon carbide sensors for health and performance monitoring of aerospace systems: A review
DG Senesky, B Jamshidi, KB Cheng, AP Pisano
IEEE Sensors Journal 9 (11), 1472-1478, 2009
2402009
A SiC MEMS resonant strain sensor for harsh environment applications
RG Azevedo, DG Jones, AV Jog, B Jamshidi, DR Myers, L Chen, X Fu, ...
IEEE Sensors Journal 7 (4), 568-576, 2007
2282007
Advances in silicon carbide science and technology at the micro-and nanoscales
R Maboudian, C Carraro, DG Senesky, CS Roper
Journal of Vacuum Science & Technology A 31 (5), 2013
1862013
AlN/3C–SiC composite plate enabling high‐frequency and high‐Q micromechanical resonators
CM Lin, YY Chen, VV Felmetsger, DG Senesky, AP Pisano
Advanced Materials 24 (20), 2722-2727, 2012
1822012
Solar-blind photodetectors for harsh electronics
DS Tsai, WC Lien, DH Lien, KM Chen, ML Tsai, DG Senesky, YC Yu, ...
Scientific reports 3 (1), 2628, 2013
1432013
Temperature sensor based on 4H-silicon carbide pn diode operational from 20 C to 600 C
N Zhang, CM Lin, DG Senesky, AP Pisano
Applied Physics Letters 104 (7), 2014
1222014
High-Q aluminum nitride Lamb wave resonators with biconvex edges
CM Lin, YJ Lai, JC Hsu, YY Chen, DG Senesky, AP Pisano
Applied Physics Letters 99 (14), 2011
1072011
AlN thin films grown on epitaxial 3C–SiC (100) for piezoelectric resonant devices
CM Lin, WC Lien, VV Felmetsger, MA Hopcroft, DG Senesky, AP Pisano
Applied Physics Letters 97 (14), 2010
942010
4H–SiC Metal–Semiconductor–Metal Ultraviolet Photodetectors in Operation of 450
WC Lien, DS Tsai, DH Lien, DG Senesky, JH He, AP Pisano
IEEE Electron Device Letters 33 (11), 1586-1588, 2012
912012
Surface acoustic wave devices on AlN/3C–SiC/Si multilayer structures
CM Lin, YY Chen, VV Felmetsger, WC Lien, T Riekkinen, DG Senesky, ...
Journal of Micromechanics and Microengineering 23 (2), 025019, 2013
852013
Suppression of Persistent Photoconductivity in AlGaN/GaN Ultraviolet Photodetectors Using In Situ Heating
M Hou, H So, AJ Suria, AS Yalamarthy, DG Senesky
IEEE Electron Device Letters 38 (1), 56-59, 2016
842016
High responsivity, low dark current ultraviolet photodetectors based on two-dimensional electron gas interdigitated transducers
PF Satterthwaite, AS Yalamarthy, NA Scandrette, AKM Newaz, ...
Acs Photonics 5 (11), 4277-4282, 2018
792018
New developments in sensing technology for structural health monitoring
SC Mukhopadhyay
Springer Science & Business Media, 2011
792011
Anchor loss reduction in AlN Lamb wave resonators using phononic crystal strip tethers
CM Lin, JC Hsu, DG Senesky, AP Pisano
2014 IEEE International Frequency Control Symposium (FCS), 1-5, 2014
742014
Profile evolution of high aspect ratio silicon carbide trenches by inductive coupled plasma etching
KM Dowling, EH Ransom, DG Senesky
Journal of Microelectromechanical Systems 26 (1), 135-142, 2016
672016
Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures
TK Nguyen, HP Phan, T Dinh, KM Dowling, ARM Foisal, DG Senesky, ...
Materials & Design 156, 441-445, 2018
662018
Continuous V-grooved AlGaN/GaN surfaces for high-temperature ultraviolet photodetectors
H So, J Lim, DG Senesky
IEEE Sensors Journal 16 (10), 3633-3639, 2016
582016
Nanoarchitectonics for wide bandgap semiconductor nanowires: Toward the next generation of nanoelectromechanical systems for environmental monitoring
TA Pham, A Qamar, T Dinh, MK Masud, M Rais‐Zadeh, DG Senesky, ...
Advanced Science 7 (21), 2001294, 2020
572020
Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure
HP Phan, KM Dowling, TK Nguyen, T Dinh, DG Senesky, T Namazu, ...
Materials & Design 156, 16-21, 2018
512018
Monolithic mtesla-level magnetic induction by self-rolled-up membrane technology
W Huang, Z Yang, MD Kraman, Q Wang, Z Ou, MM Rojo, AS Yalamarthy, ...
Science advances 6 (3), eaay4508, 2020
452020
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
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