| Three-dimensional integrated circuits AW Topol, DC La Tulipe, L Shi, DJ Frank, K Bernstein, SE Steen, A Kumar, ... IBM Journal of Research and Development 50 (4.5), 491-506, 2006 | 916 | 2006 |
| Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs) AW Topol, DC La Tulipe, L Shi, SM Alam, DJ Frank, SE Steen, J Vichiconti, ... IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest …, 2005 | 370 | 2005 |
| Methods of forming wiring to transistor and related transistor DJ Frank, DC La Tulipe Jr, SE Steen, AW Topol US Patent 7,666,723, 2010 | 274 | 2010 |
| Overlay as the key to drive wafer scale 3D integration SE Steen, D LaTulipe, AW Topol, DJ Frank, K Belote, D Posillico Microelectronic engineering 84 (5-8), 1412-1415, 2007 | 269 | 2007 |
| Electrical characterization of germanium p-channel MOSFETs H Shang, H Okorn-Schimdt, J Ott, P Kozlowski, S Steen, EC Jones, ... IEEE Electron Device Letters 24 (4), 242-244, 2003 | 211 | 2003 |
| High mobility p-channel germanium MOSFETs with a thin Ge oxynitride gate dielectric H Shang, H Okorn-Schmidt, KK Chan, M Copel, JA Ott, PM Kozlowski, ... Digest. International Electron Devices Meeting,, 441-444, 2002 | 163 | 2002 |
| On the integration of CMOS with hybrid crystal orientations M Yang, V Chan, SH Ku, M Ieong, L Shi, KK Chan, CS Murthy, RT Mo, ... Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004., 160-161, 2004 | 59 | 2004 |
| The over-bump applied resin wafer-level underfill process: Process, material and reliability C Feger, N LaBianca, M Gaynes, S Steen, Z Liu, R Peddi, M Francis 2009 59th electronic components and technology conference, 1502-1505, 2009 | 53 | 2009 |
| Lateral displacement induced disorder in L10-FePt nanostructures by ion-implantation N Gaur, S Kundu, SN Piramanayagam, SL Maurer, HK Tan, SK Wong, ... Scientific reports 3 (1), 1907, 2013 | 30 | 2013 |
| The attack of the" Holey Shmoos": a case study of advanced DFD and picosecond imaging circuit analysis (PICA) W Huott, M McManus, D Knebel, S Steen, D Manzer, P Sanda, S Wilson, ... International Test Conference 1999. Proceedings (IEEE Cat. No. 99CH37034 …, 1999 | 29 | 1999 |
| System and method for virtual control of laboratory equipment F Stellari, SE Steen, P Song US Patent 8,041,437, 2011 | 26 | 2011 |
| Aggressively scaled (0.143/spl mu/m/sup 2/) 6T-SRAM cell for the 32 nm node and beyond DM Fried, JM Hergenrother, AW Topol, L Chang, L Sekaric, JW Sleight, ... IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004 | 25 | 2004 |
| PICA: Backside failure analysis of CMOS circuits using Picosecond Imaging Circuit Analysis MK Mc Manus, JA Kash, SE Steen, S Polonsky, JC Tsang, DR Knebel, ... Microelectronics Reliability 40 (8-10), 1353-1358, 2000 | 25 | 2000 |
| Hybrid lithography: The marriage between optical and e-beam lithography. A method to study process integration and device performance for advanced device nodes S Steen, SJ McNab, L Sekaric, I Babich, J Patel, J Bucchignano, M Rooks, ... Microelectronic engineering 83 (4-9), 754-761, 2006 | 21 | 2006 |
| Laterally scaled Si-Si/sub 0.7/Ge/sub 0.3/n-MODFETs with f/sub max/> 200 GHz and low operating bias SJ Koester, KL Saenger, JO Chu, QC Ouyang, JA Ott, KA Jenkins, ... IEEE electron device letters 26 (3), 178-180, 2005 | 19 | 2005 |
| Looking into the crystal ball: Future device learning using hybrid E-beam and optical lithography SE Steen, SJ McNab, L Sekaric, I Babich, J Patel, J Bucchignano, ... Emerging Lithographic Technologies IX 5751, 26-34, 2005 | 18 | 2005 |
| Picosecond imaging circuit analysis of the IBM G6 microprocessor cache M McManus, P Sanda, S Steen, D Knebel, D Manzer, S Polonsky, B Huott, ... International Symposium for Testing and Failure Analysis 30835, 35-38, 1999 | 18 | 1999 |
| Methods of fabricating solar cell chips HJ Eickelmann, M Haag, HJ Hovel, RK Krause, M Schmidt, X Shao, ... US Patent 7,897,434, 2011 | 16 | 2011 |
| 80 nm gate-length Si/Si0. 7Ge0. 3n-MODFET with 194 GHz fmax SJ Koester, KL Saenger, JO Chu, QC Ouyang, JA Ott, MJ Rooks, ... Electronics Letters 39 (23), 1684-1685, 2003 | 15 | 2003 |
| First-order reversal curve investigations on the effects of ion implantation in magnetic media N Gaur, SN Piramanayagam, SL Maurer, SE Steen, H Yang, CS Bhatia IEEE transactions on magnetics 48 (11), 2753-2756, 2012 | 14 | 2012 |
Anna TopolIBMEmail verificata su us.ibm.com
