A PAM4 dielectric waveguide link in 28 nm CMOS K Dens, J Vaes, S Ooms, M Wagner, P Reynaert ESSCIRC 2021-IEEE 47th European Solid State Circuits Conference (ESSCIRC …, 2021 | 35 | 2021 |
Plastic microwave fibers at millimeter-wave and THz frequencies as a low cost data link J Vaes, K Dens, G Ducournau, P Reynaert 2021 IEEE MTT-S International Microwave Symposium (IMS), 589-591, 2021 | 13 | 2021 |
Polymer microwave fiber: A new communication concept that blends wireless, wireline and optical communication P Reynaert, K Dens, C D'heer, D Simic, J Vaes, B Philippe, S Ooms 2019 26th IEEE International Conference on Electronics, Circuits and Systems …, 2019 | 13 | 2019 |
A 100-Gb/s 3-m Dual-Band PAM-4 Dielectric Waveguide Link with 1.9 pJ/bit/m Efficiency in 28-nm CMOS K Dens, J Vaes, C Bluemm, G Guimaraes, B Gungor, C Xie, A Dyck, ... 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 13-16, 2023 | 12 | 2023 |
Novel broadband transition for rectangular dielectric waveguide to planar circuit board at D band WL Tsai, I Ocket, J Vaes, M Cauwe, P Reynaert, B Nauwelaers 2018 IEEE/MTT-S International Microwave Symposium-IMS, 386-389, 2018 | 9 | 2018 |
Dispersion in Millimeter-wave and THz Dielectric Waveguides: Modeling, Measurement and Performance Limitations J Vaes, P Reynaert 2020 50th European Microwave Conference (EuMC), 991-994, 2021 | 4 | 2021 |
A pcb-embedding scheme for lcp ribbon waveguide at d-band J Vaes, I Ocket, WL Tsai, M Cauwe, P Reynaerr, B Nauwelaers 2018 IEEE/MTT-S International Microwave Symposium-IMS, 382-385, 2018 | 3 | 2018 |
Design of a Noncoherent 100-Gb/s 3-m Dual-Band PAM-4 Dielectric Waveguide Link in 28-nm CMOS K Dens, J Vaes, C Bluemm, G Guimaraes, B Gungor, C Xie, A Dyck, ... IEEE Journal of Solid-State Circuits, 2024 | 2 | 2024 |
Device for multiplexing or demultiplexing polarised waves C Blümm, C Xie, A Dyck, P Reynaert, J Vaes US Patent App. 18/392,765, 2024 | | 2024 |
Polymer Microwave Fiber as a High Data Rate Channel J Vaes | | 2024 |
PCB-embedded dielectric waveguides: An alternative for chip-to-chip and module-to-module communications J Vaes, P Reynaert FIRST INTERNATIONAL WORKSHOP ON POLYMER MICROWAVE FIBER TECHNOLOGY, Date …, 2019 | | 2019 |