Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders C Kanchanomai, Y Miyashita, Y Mutoh Journal of Electronic Materials 31, 456-465, 2002 | 184 | 2002 |
Fatigue failure of an orthopedic implant–A locking compression plate C Kanchanomai, V Phiphobmongkol, P Muanjan Engineering Failure Analysis 15 (5), 521-530, 2008 | 134 | 2008 |
Low cycle fatigue test for solders using non-contact digital image measurement system C Kanchanomai, S Yamamoto, Y Miyashita, Y Mutoh, AJ McEvily International Journal of Fatigue 24 (1), 57-67, 2002 | 132 | 2002 |
Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5 Sn–3.5 Ag C Kanchanomai, Y Miyashita, Y Mutoh, SL Mannan Materials Science and Engineering: A 345 (1-2), 90-98, 2003 | 116 | 2003 |
Low cycle fatigue behavior and mechanisms of a eutectic Sn–Pb solder 63Sn/37Pb C Kanchanomai, Y Miyashita, Y Mutoh International Journal of Fatigue 24 (6), 671-683, 2002 | 112 | 2002 |
Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5 Sn/3.5 Ag C Kanchanomai, Y Miyashita, Y Mutoh Journal of electronic materials 31, 142-151, 2002 | 88 | 2002 |
Effects of loading rate on fracture behavior and mechanism of thermoset epoxy resin C Kanchanomai, S Rattananon, M Soni Polymer Testing 24 (7), 886-892, 2005 | 80 | 2005 |
Effect of temperature on isothermal low cycle fatigue properties of Sn–Ag eutectic solder C Kanchanomai, Y Mutoh Materials Science and Engineering: A 381 (1-2), 113-120, 2004 | 79 | 2004 |
Strain-rate effects on low cycle fatigue mechanism of eutectic Sn–Pb solder C Kanchanomai, Y Miyashita, Y Mutoh International Journal of Fatigue 24 (9), 987-993, 2002 | 76 | 2002 |
Low-Cycle fatigue prediction model for Pb-free solder 96.5 Sn-3.5 Ag C Kanchanomai, Y Mutoh Journal of Electronic Materials 33, 329-333, 2004 | 67 | 2004 |
Wear characteristic of epoxy resin filled with crushed-silica particles C Kanchanomai, N Noraphaiphipaksa, Y Mutoh Composites Part B: Engineering 42 (6), 1446-1452, 2011 | 66 | 2011 |
Analysis of the fatigue performance of elastic rail clip A Hasap, P Paitekul, N Noraphaiphipaksa, C Kanchanomai Engineering Failure Analysis 92, 195-204, 2018 | 57 | 2018 |
Effect of residual stress on fatigue failure of carbonitrided low-carbon steel C Kanchanomai, W Limtrakarn Journal of Materials Engineering and Performance 17, 879-887, 2008 | 49 | 2008 |
Stiffness and endurance of a locking compression plate fixed on fractured femur C Kanchanomai, P Muanjan, V Phiphobmongkol Journal of applied biomechanics 26 (1), 10-16, 2010 | 46 | 2010 |
Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder C Kanchanomai, Y Miyashita, Y Mutoh, SL Mannan Soldering & surface mount technology 14 (3), 30-36, 2002 | 42 | 2002 |
Temperature effect on low cycle fatigue behavior of Sn–Pb eutectic solder C Kanchanomai, Y Mutoh Scripta Materialia 50 (1), 83-88, 2004 | 39 | 2004 |
Fatigue crack growth behaviour of lead‐containing and lead‐free solders Y Mutoh, J Zhao, Y Miyashita, C Kanchanomai Soldering & surface mount technology 14 (3), 37-45, 2002 | 39 | 2002 |
Fatigue crack growth behavior in Sn–Pb eutectic solder/copper joint under mode I loading C Kanchanomai, W Limtrakarn, Y Mutoh Mechanics of Materials 37 (11), 1166-1174, 2005 | 38 | 2005 |
The microstructure and strength of copper alloy brazing joints A Hasap, N Noraphaiphipaksa, C Kanchanomai Weld. J 93 (4), 116-123, 2014 | 35 | 2014 |
Numerical and experimental investigations on fretting fatigue: Relative slip, crack path, and fatigue life N Noraphaiphipaksa, C Kanchanomai, Y Mutoh Engineering Fracture Mechanics 112, 58-71, 2013 | 35 | 2013 |