Articoli con mandati relativi all'accesso pubblico - Yu Dian LimUlteriori informazioni
Non disponibili pubblicamente: 24
Field emission cathode based on three-dimensional framework carbon and its operation under the driving of a triboelectric nanogenerator
J Chen, B Yang, YD Lim, L Su, J Yang, R Guo, BK Tay, X Yan
Nano Energy 49, 308-315, 2018
Mandati: Chinese Academy of Sciences
Ti3C2 (MXene) based field electron emitters
J Chen, B Yang, YD Lim, W Duan, Y Zhao, BK Tay, X Yan
Nanotechnology 31 (28), 285701, 2020
Mandati: Chinese Academy of Sciences, National Natural Science Foundation of China
In-depth parametric study of Ar or N2 plasma activated Cu surfaces for Cu-Cu direct bonding
L Hu, SCK Goh, J Tao, YD Lim, P Zhao, MJZ Lim, CS Tan
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 420-425, 2021
Mandati: A*Star, Singapore
Fabrication and characterization of surface electrode ion trap for quantum computing
J Tao, NP Chew, L Guidoni, YD Lim, P Zhao, CS Tan
2018 ieee 20th electronics packaging technology conference (eptc), 363-366, 2018
Mandati: A*Star, Singapore
Time-dependent evolution study of Ar/N2 plasma-activated Cu surface for enabling two-step Cu-Cu direct bonding in a non-vacuum environment
L Hu, SCK Goh, J Tao, YD Lim, P Zhao, MJZ Lim, T Salim, ...
ECS Journal of Solid State Science and Technology 10 (12), 124001, 2021
Mandati: A*Star, Singapore
3D integration of CMOS-compatible surface electrode ion trap and silicon photonics for scalable quantum computing
J Tao, YD Lim, HY Li, NP Chew, AAA Apriyana, L Bu, P Zhao, L Guidoni, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1735-1743, 2019
Mandati: A*Star, Singapore
Two-Step Ar/N2 Plasma-Activated Al Surface for Al-Al Direct Bonding
L Hu, YD Lim, P Zhao, MJZ Lim, CS Tan
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 324-329, 2022
Mandati: A*Star, Singapore
Multi-die to wafer bonding through plasma-activated Cu-Cu direct bonding in ambient conditions
L Hu, SCK Goh, YD Lim, P Zhao, MJZ Lim, CS Tan
2021 IEEE International 3D Systems Integration Conference (3DIC), 1-5, 2021
Mandati: A*Star, Singapore
Triboelectric nanogenerator driven carbon nanotube cathode: a sustainable self-powering electron source
J Chen, YD Lim, Y Zhao, J Chen, B Yang, Z Wu, Y Li
ACS Applied Electronic Materials 3 (1), 476-484, 2021
Mandati: National Natural Science Foundation of China
Systematic investigation and characterization of Ag paste for LED die attach
L Hu, J Tao, S Bao, SCK Goh, YD Lim, P Zhao, MJZ Lim, SC Tan, ...
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 140-143, 2021
Mandati: A*Star, Singapore
Heterogenous Integration of Silicon Ion Trap and Glass Interposer for Scalable Quantum Computing Enabled by TSV, Micro-bumps and RDL
P Zhao, HY Li, J Tao, YD Lim, WW Seit, L Guidoni, CS Tan
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 279-284, 2021
Mandati: A*Star, Singapore
Plasma-activated Cu-Cu direct bonding in ambient for die-die and die-wafer bonding
L Hu, YD Lim, P Zhao, MJZ Lim, CS Tan
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM …, 2022
Mandati: A*Star, Singapore
Performance comparison of high resistivity silicon, silicon with grounding plane and glass as substrate of ion trap for quantum information processing
P Zhao, J Tao, HY Li, YD Lim, Y Lin, L Guidoni, CS Tan
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-5, 2020
Mandati: A*Star, Singapore
Modeling and Predicting the Beam Properties from Grating Structures Using Deep Neural Network
YD Lim, P Zhao, L Guidoni, JP Likforman, CS Tan
2023 18th International Microsystems, Packaging, Assembly and Circuits …, 2023
Mandati: Agence Nationale de la Recherche
Surface Electrode Ion Trap Developed and Improvement by Oxide-First-Metal-Last Approach for High Performance Quantum Computing
HY Li, WW Seit, H Gilho, J Tao, YD Lim, P Zhao, CS Tan
2020 IEEE International Symposium on the Physical and Failure Analysis of …, 2020
Mandati: A*Star, Singapore
Comparative Study of Die-Attach Materials for LED Die Bonding
L Hu, S Bao, Y Wang, SCK Goh, YD Lim, P Zhao, MJZ Lim, W Miao, ...
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 447-451, 2022
Mandati: A*Star, Singapore
Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electronics Packaging
L Hu, SCK Goh, YD Lim, P Zhao, MJZ Lim, W Miao, CS Tan
2022 17th International Microsystems, Packaging, Assembly and Circuits …, 2022
Mandati: A*Star, Singapore
Ceramic Pin Grid Array with Built-in Interconnects to Locate TSV Integrated Ion Trap for Wire Bonding-free Assembly
P Zhao, HY Li, YD Lim, LX Hu, WW Seit, L Guidoni, CS Tan
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 1-5, 2022
Mandati: Agence Nationale de la Recherche, National Research Foundation, Singapore
Design considerations and fabrication challenges of surface electrode ion trap with TSV integration
J Tao, HY Li, P Zhao, YD Lim, AAA Apriyana, CS Tan
2019 International 3D Systems Integration Conference (3DIC), 1-5, 2019
Mandati: A*Star, Singapore
Time Evolution Study of Two-Step Plasma-Treated Copper-Copper Direct Bonding in Ambient
L Hu, YD Lim, P Zhao, MJZ Lim, W Miao, X Ju, CS Tan
2023 International Conference on Electronics Packaging (ICEP), 45-46, 2023
Mandati: A*Star, Singapore
Le informazioni sulla pubblicazione e sul finanziamento vengono stabilite automaticamente da un software