| A chip-first microwave package using multimaterial aerosol jet printing MT Craton, X Konstantinou, JD Albrecht, P Chahal, J Papapolymerou IEEE Transactions on Microwave Theory and Techniques 68 (8), 3418-3427, 2020 | 47 | 2020 |
| A chip-first approach to millimeter-wave circuit packaging MT Craton, JD Albrecht, P Chahal, J Papapolymerou IEEE Microwave and Wireless Components Letters 29 (2), 116-118, 2019 | 28 | 2019 |
| 3D printed high frequency coaxial transmission line based circuits M Craton, JA Byford, V Gjokaj, J Papapolymerou, P Chahal 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1080-1087, 2017 | 24 | 2017 |
| In Situ Nanocomposite Fabrication for RF Electronics Applications With Additive Manufacturing MT Craton, JD Albrecht, P Chahal, J Papapolymerou IEEE Transactions on Microwave Theory and Techniques 68 (5), 1646-1659, 2020 | 20 | 2020 |
| Realization of fully 3D printed W-band bandpass filters using aerosol jet printing technology MT Craton, J Sorocki, I Piekarz, S Gruszczynski, K Wincza, ... 2018 48th European Microwave Conference (EuMC), 1013-1016, 2018 | 20 | 2018 |
| Application of aerosol jet 3-D printing with conductive and nonconductive inks for manufacturing mm-wave circuits I Piekarz, J Sorocki, MT Craton, K Wincza, S Gruszczynski, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (3 …, 2018 | 19 | 2018 |
| Additive Manufacturing of a Wideband Capable W-Band Packaging Strategy MT Craton, JD Albrecht, P Chahal, J Papapolymerou IEEE Microwave and Wireless Components Letters 31 (6), 697-700, 2021 | 17 | 2021 |
| Additive Manufacturing of a W-Band System-on-Package MT Craton, X Konstantinou, JD Albrecht, P Chahal, J Papapolymerou IEEE Transactions on Microwave Theory and Techniques 69 (9), 4191-4198, 2021 | 16 | 2021 |
| Multimaterial aerosol jet printed magnetic nanocomposites for microwave circuits MT Craton, JD Albrecht, P Chahal, J Papapolymerou IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 10 | 2021 |
| Fully additively manufactured broadband low loss high frequency interconnects MT Craton, C Oakley, JD Albrecht, P Chahal, J Papapolymerou 2018 Asia-Pacific Microwave Conference (APMC), 327-329, 2018 | 10 | 2018 |
| A bi-material fully aerosol jet printed W-band quasi-Yagi-Uda antenna Y He, MT Craton, P Chahal, J Papapolymerou 2018 11th Global Symposium on Millimeter Waves (GSMM), 1-3, 2018 | 9 | 2018 |
| Additively manufactured interdigitated capacitors using barium titanate nanocomposite inks MT Craton, Y He, A Roch, P Chahal, J Papapolymerou 2019 49th European Microwave Conference (EuMC), 488-491, 2019 | 6 | 2019 |
| Ultra-wideband transmission lines on complex structures via extendable aerosol jet 3D-printing X Konstantinou, MT Craton, JD Albrecht, J Papapolymerou 2021 IEEE International Conference on Microwaves, Antennas, Communications …, 2021 | 5 | 2021 |
| Aerosol Jet 3D-printed compact EBG resonators X Konstantinou, MT Craton, JD Albrecht, J Papapolymerou 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2308-2313, 2021 | 3 | 2021 |
| A monolithic wilkinson power divider on diamond via a combination of additive manufacturing and thin-film process X Konstantinou, CJ Herrera-Rodriguez, MT Craton, A Hardy, C Crump, ... 2020 IEEE Radio and Wireless Symposium (RWS), 201-204, 2020 | 2 | 2020 |
| 3d printed integrated microfluidic cooling for high power rf applications M Craton, MIM Ghazali, B Wright, KY Park, P Chahal, J Papapolymerou International Symposium on Microelectronics 2017 (1), 000675-000680, 2017 | 2 | 2017 |
| A monolithic RF lowpass filter on diamond via additive manufacturing X Konstantinou, MT Craton, CJ Herrera-Rodriguez, A Hardy, JD Albrecht, ... 2020 IEEE USNC-CNC-URSI North American Radio Science Meeting (Joint with AP …, 2020 | 1 | 2020 |
| Microwave and Millimeter Wave System Integration with Additive Manufacturing MT Craton Michigan State University, 2020 | 1 | 2020 |
| A polyjet 3D printed alternative for package to RFIC interconnects M Craton, JA Byford, J Papapolymerou, P Chahal, JD Arbrecht 2017 47th European Microwave Conference (EuMC), 500-503, 2017 | 1 | 2017 |
| Method of additively manufacturing an integrated circuit of an interconnect packaging structure I Papapolymerou, P Chahal, JD Albrecht, MT Craton, C Oakley US Patent 12,027,477, 2024 | | 2024 |
John PapapolymerouInterim Dean of Engineering and MSU Research Foundation ProfessorEmail verificata su egr.msu.edu