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- Tony F HeinzDepts. of Applied Physics, Photon Science, and, by courtesy, of Electrical Eng., SLAC, StanfordEmail verificata su stanford.edu
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityEmail verificata su columbia.edu
- Alexey ChernikovDresden University of Technology (TU Dresden), University of RegensburgEmail verificata su tu-dresden.de
- Heather M. HillBureau of Engraving and Printing, Department of TreasuryEmail verificata su bep.gov
- Albert RigosiNational Institute of Standards and TechnologyEmail verificata su nist.gov
- Annie Xian ZhangMechanical Engineering, Stevens Institute of TechnologyEmail verificata su stevens.edu
- Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityEmail verificata su snu.ac.kr
- Daniel A. ChenetColumbia UniversityEmail verificata su columbia.edu
- Philip KimHarvard UniversityEmail verificata su g.harvard.edu
- Yufeng Hao (郝玉峰)Professor of Materials Science and Engineering, Nanjing UniversityEmail verificata su nju.edu.cn
- Mark S HybertsenSenior Physicist, Emeritus, Center for Functional Nanomaterials, Brookhaven National LaboratoryEmail verificata su bnl.gov
- Lei WangColumbia UniversityEmail verificata su columbia.edu
- Damon B. FarmerIBM T.J. Watson Research CenterEmail verificata su us.ibm.com
- Phaedon AvourisIBM Fellow, Emeritus and University of Minnesota, MinneapolisEmail verificata su umn.edu
- En-Min ShihColumbia UniversityEmail verificata su columbia.edu
- David ReisStanford PULSE Institute, Department of Applied Physics, Department of Photon ScienceEmail verificata su stanford.edu
- Hanzhe LiuPurdue UniversityEmail verificata su purdue.edu
- Yong Sing YouStanford UniversityEmail verificata su slac.stanford.edu
- Shambhu GhimireSLAC National Accelerator Lab & Stanford UniversityEmail verificata su slac.stanford.edu
- Cory R. DeanColumbia UnviersityEmail verificata su phys.columbia.edu