| Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics M Krishtab, I Stassen, T Stassin, AJ Cruz, OO Okudur, S Armini, C Wilson, ... Nature Communications 10 (1), 3729, 2019 | 142 | 2019 |
| Integrated cleanroom process for the vapor-phase deposition of large-area zeolitic imidazolate framework thin films AJ Cruz, I Stassen, M Krishtab, K Marcoen, T Stassin, ... Chemistry of Materials 31 (22), 9462-9471, 2019 | 68 | 2019 |
| Porosimetry for Thin Films of Metal–Organic Frameworks: A Comparison of Positron Annihilation Lifetime Spectroscopy and Adsorption‐Based Methods T Stassin, R Verbeke, AJ Cruz, S Rodríguez‐Hermida, I Stassen, ... Advanced Materials 33 (17), 2006993, 2021 | 67 | 2021 |
| Low-k films modification under EUV and VUV radiation TV Rakhimova, AT Rakhimov, YA Mankelevich, DV Lopaev, AS Kovalev, ... Journal of Physics D: Applied Physics 47 (2), 025102, 2013 | 67 | 2013 |
| Selective Ru ALD as a catalyst for sub-seven-nanometer bottom-up metal interconnects I Zyulkov, M Krishtab, S De Gendt, S Armini ACS applied materials & interfaces 9 (36), 31031-31041, 2017 | 58 | 2017 |
| Impact of Plasma Pretreatment and Pore Size on the Sealing of Ultra-Low-k Dielectrics by Self-Assembled Monolayers Y Sun, M Krishtab, H Struyf, P Verdonck, S De Feyter, MR Baklanov, ... Langmuir 30 (13), 3832-3844, 2014 | 33 | 2014 |
| Fractally aggregated micro-and nanosystems synthesized from sols IE Kononova, VA Moshnikov, MB Krishtab, IA Pronin Glass Physics and Chemistry 40, 190-202, 2014 | 29 | 2014 |
| Study of chemical vapor deposition of manganese on porous SiCOH low-k dielectrics using Bis (ethylcyclopentadienyl) manganese N Jourdan, MB Krishtab, MR Baklanov, J Meersschaut, CJ Wilson, ... Electrochemical and Solid-State Letters 15 (5), H176, 2012 | 28 | 2012 |
| Effect of porosity and pore size on dielectric constant of organosilicate based low-k films: An analytical approach AP Palov, EN Voronina, TV Rakhimova, DV Lopaev, SM Zyryanov, ... Journal of Vacuum Science & Technology B 34 (4), 2016 | 26 | 2016 |
| Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young’s modulus P Verdonck, C Wang, QT Le, L Souriau, K Vanstreels, M Krishtab, ... Microelectronic engineering 120, 225-229, 2014 | 26 | 2014 |
| Pore sealing of porous ultralow-k dielectrics by self-assembled monolayers combined with atomic layer deposition S Armini, JL Prado, J Swerts, Y Sun, M Krishtab, J Meersschaut, M Blauw, ... ECS Solid State Letters 1 (2), P42, 2012 | 26 | 2012 |
| Pore sealing of k 2.0 dielectrics assisted by self-assembled monolayers deposited from vapor phase S Armini, JL Prado, M Krishtab, J Swerts, P Verdonck, J Meersschaut, ... Microelectronic engineering 120, 240-245, 2014 | 25 | 2014 |
| Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics JF De Marneffe, L Zhang, M Heyne, M Lukaszewicz, SB Porter, F Vajda, ... Journal of Applied Physics 118 (13), 2015 | 23 | 2015 |
| Dependence of dielectric constant of SiOCH low-k films on porosity and pore size A Palov, TV Rakhimova, MB Krishtab, MR Baklanov Journal of Vacuum Science & Technology B 33 (2), 2015 | 23 | 2015 |
| On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control Z Tőkei, I Ciofi, P Roussel, P Debacker, P Raghavan, MH Van Der Veen, ... 2016 IEEE Symposium on VLSI Technology, 1-2, 2016 | 22 | 2016 |
| Effect of the C-bridge length on the ultraviolet-resistance of oxycarbosilane low-k films M Redzheb, L Prager, S Naumov, M Krishtab, S Armini, P Van Der Voort, ... Applied Physics Letters 108 (1), 2016 | 19 | 2016 |
| Plasma induced damage mitigation in spin-on self-assembly based ultra low-k dielectrics using template residues M Krishtab, JF De Marneffe, S De Gendt, MR Baklanov Applied Physics Letters 110 (1), 2017 | 17 | 2017 |
| Leakage current induced by surfactant residues in self-assembly based ultralow-k dielectric materials M Krishtab, V Afanas' ev, A Stesmans, S De Gendt Applied Physics Letters 111 (3), 2017 | 12 | 2017 |
| On the mechanical and electrical properties of self-assembly-based organosilicate porous films M Redzheb, S Armini, T Berger, M Jacobs, M Krishtab, K Vanstreels, ... Journal of Materials Chemistry C 5 (33), 8599-8607, 2017 | 12 | 2017 |
| UV cure of oxycarbosilane low-k films M Redzheb, L Prager, M Krishtab, S Armini, K Vanstreels, A Franquet, ... Microelectronic Engineering 156, 103-107, 2016 | 12 | 2016 |
Mikhail BaklanovEmail verificata su ncut.edu.cn