| Pseudocapacitive performance of vertical copper oxide nanoflakes Z Endut, M Hamdi, WJ Basirun Thin Solid Films 528, 213-216, 2013 | 100 | 2013 |
| Piezoresistive effects in controllable defective HFTCVD graphene-based flexible pressure sensor MAS Mohammad Haniff, S Muhammad Hafiz, KAA Wahid, Z Endut, ... Scientific reports 5 (1), 14751, 2015 | 71 | 2015 |
| Graphene oxide electrocatalyst on MnO2 air cathode as an efficient electron pump for enhanced oxygen reduction in alkaline solution WJ Basirun, M Sookhakian, S Baradaran, Z Endut, MR Mahmoudian, ... Scientific reports 5 (1), 9108, 2015 | 36 | 2015 |
| Supercapacitance of bamboo-type anodic titania nanotube arrays Z Endut, M Hamdi, WJ Basirun Surface and Coatings Technology 215, 75-78, 2013 | 34 | 2013 |
| Nitrogen-doped multiwalled carbon nanotubes decorated with copper (I) oxide nanoparticles with enhanced capacitive properties MASM Haniff, SM Hafiz, KA Wahid, Z Endut, MI Syono, NM Huang, ... Journal of materials science 52, 6280-6290, 2017 | 31 | 2017 |
| An investigation on formation and electrochemical capacitance of anodized titania nanotubes Z Endut, M Hamdi, WJ Basirun Applied surface science 280, 962-966, 2013 | 20 | 2013 |
| Optimization and functionalization of anodized titania nanotubes for redox supercapacitor Z Endut, M Hamdi, WJ Basirun Thin Solid Films 549, 306-312, 2013 | 14 | 2013 |
| Investigation of warpage induced on molded strip of QFN package U Mokhtar, R Rasid, I Ahmad, Z Endut, S Esa, K Krishnasamy Solid State Science and Technology 16 (2), 189-197, 2008 | 3 | 2008 |
| Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging Z Endut, I Ahmad, A Zaharim, NM Sukemi 2006 8th Electronics Packaging Technology Conference, 879-884, 2006 | 3 | 2006 |
| Lead corrosion and formation of lead oxides from a lead-air cell in methanesulfonic acid WJ Basirun, IM Saeed, H Ghadimi, M Ladan, MR Mahmoudian, M Ebadi, ... Journal of New Materials for Electrochemical Systems 19 (4), 217-222, 2016 | 2 | 2016 |
| Impact of low-k devices on failure mode of flip chip tensile pull test Z Endut, I Ahmad, GLH Swee, NM Sukemi 2006 International Conference on Electronic Materials and Packaging, 1-5, 2006 | 1 | 2006 |
| Piezoresistive effects in controllable defective HFTCVD graphene-based flexible pressure sensor Scientific Reports, 14751, 2015 | | 2015 |
| Synthesis and Characterization of Anodic Titania Nanotubes for Supercapacitor Application Z Endut PQDT-Global, 2013 | | 2013 |
| Dicing laminated wafer for QFN 3D stacked die packaging S Abdullah, Z Endut, I Ahmad, A Jalar, SM Yusof Advanced Materials Research 31, 202-205, 2008 | | 2008 |
| A STUDY OF UNDERFILL MORPHOLOGY AND FILLER CONTENT USING SCANNING ELECTRON MICROSCOPY AND THERMOGRAVIMETRIC ANALYZER I AHMAD, Z ENDUT, A ZAHARIM, NAM SUKEMI Journal of Sustainability Science and Management, 2007 | | 2007 |
| Solder bump strength and failure mode of low-k flip chip device Z Endut, I Ahmad, GLH Swee, NM Sukemi 2006 IEEE International Conference on Semiconductor Electronics, 991-995, 2006 | | 2006 |
| Lead Corrosion and Formation of Lead Oxides from a Lead-air Cell in Methanesulfonic Acid Lead Corrosion and Formation of Lead Oxides from a Lead-air Cell in Methanesulfonic Acid WJ Basirun, IM Saeedc, H Ghadimi, M Ladan, MR Mahmoudian, M Ebadi, ... | | |
