| Integrating mems and ics AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ... Microsystems & Nanoengineering 1 (1), 1-16, 2015 | 341 | 2015 |
| Integrated silicon photonic MEMS N Quack, AY Takabayashi, H Sattari, P Edinger, G Jo, SJ Bleiker, ... Microsystems & Nanoengineering 9 (1), 27, 2023 | 65 | 2023 |
| High-aspect-ratio through silicon vias for high-frequency application fabricated by magnetic assembly of gold-coated nickel wires SJ Bleiker, AC Fischer, U Shah, N Somjit, T Haraldsson, N Roxhed, ... IEEE Transactions on components, packaging and Manufacturing technology 5 (1 …, 2014 | 51 | 2014 |
| Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires AC Fischer, SJ Bleiker, T Haraldsson, N Roxhed, G Stemme, F Niklaus Journal of micromechanics and microengineering 22 (10), 105001, 2012 | 48 | 2012 |
| Nanoelectromechanical relay without pull-in instability for high-temperature non-volatile memory S Rana, J Mouro, SJ Bleiker, JD Reynolds, HMH Chong, F Niklaus, ... Nature communications 11 (1), 1181, 2020 | 41 | 2020 |
| Scalable manufacturing of nanogaps V Dubois, SJ Bleiker, G Stemme, F Niklaus Advanced Materials 30 (46), 1801124, 2018 | 41 | 2018 |
| Wafer-level vacuum sealing by transfer bonding of silicon caps for small footprint and ultra-thin MEMS packages X Wang, SJ Bleiker, P Edinger, C Errando-Herranz, N Roxhed, G Stemme, ... Journal of microelectromechanical systems 28 (3), 460-471, 2019 | 36 | 2019 |
| Amorphous carbon active contact layer for reliable nanoelectromechanical switches D Grogg, CL Ayala, U Drechsler, A Sebastian, WW Koelmans, SJ Bleiker, ... 2014 IEEE 27th international conference on micro electro mechanical systems …, 2014 | 30 | 2014 |
| Wafer-level hermetically sealed silicon photonic MEMS G Jo, P Edinger, SJ Bleiker, X Wang, AY Takabayashi, H Sattari, N Quack, ... Photonics Research 10 (2), A14-A21, 2022 | 29 | 2022 |
| Performance analysis of nanoelectromechanical relay-based field-programmable gate arrays T Qin, SJ Bleiker, S Rana, F Niklaus, D Pamunuwa IEEE Access 6, 15997-16009, 2018 | 28 | 2018 |
| Through-glass vias for glass interposers and MEMS packaging applications fabricated using magnetic assembly of microscale metal wires MJ Laakso, SJ Bleiker, J Liljeholm, GE Mårtensson, M Asiatici, AC Fischer, ... Ieee Access 6, 44306-44317, 2018 | 26 | 2018 |
| Adhesive wafer bonding with ultra-thin intermediate polymer layers SJ Bleiker, V Dubois, S Schröder, G Stemme, F Niklaus Sensors and Actuators A: Physical 260, 16-23, 2017 | 25 | 2017 |
| Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprint X Wang, SJ Bleiker, M Antelius, G Stemme, F Niklaus Journal of microelectromechanical systems 26 (2), 357-365, 2017 | 18 | 2017 |
| Cost-efficient wafer-level capping for MEMS and imaging sensors by adhesive wafer bonding SJ Bleiker, MM Visser Taklo, N Lietaer, A Vogl, T Bakke, F Niklaus Micromachines 7 (10), 192, 2016 | 16 | 2016 |
| Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contacts CL Ayala, D Grogg, A Bazigos, SJ Bleiker, M Fernandez-Bolanos, ... Solid-State Electronics 113, 157-166, 2015 | 14 | 2015 |
| Wafer-level heterogeneous 3D integration for MEMS and NEMS F Niklaus, M Lapisa, SJ Bleiker, V Dubois, N Roxhed, AC Fischer, ... 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D …, 2012 | 14 | 2012 |
| ICs AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ... Microsystems Nanoeng 1 (1), e16, 2015 | 12 | 2015 |
| High aspect ratio TSVs fabricated by magnetic self-assembly of gold-coated nickel wires AC Fischer, SJ Bleiker, N Somjit, N Roxhed, T Haraldsson, G Stemme, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 541-547, 2012 | 11 | 2012 |
| Wafer-level vacuum sealing for packaging of silicon photonic MEMS G Jo, P Edinger, SJ Bleiker, X Wang, AY Takabayashi, H Sattari, N Quack, ... Silicon Photonics XVI 11691, 51-57, 2021 | 10 | 2021 |
| Vacuum-sealed silicon photonic MEMS tunable ring resonator with an independent control over coupling and phase P Edinger, G Jo, CP Van Nguyen, AY Takabayashi, C Errando-Herranz, ... Optics Express 31 (4), 6540-6551, 2023 | 9 | 2023 |
