| Mikrosystemtechnik für Ingenieure W Menz, O Paul John Wiley & Sons, 2012 | 442 | 2012 |
| Magnetic phase transition in two-dimensional ultrathin Fe films on Au (100) W Dürr, M Taborelli, O Paul, R Germar, W Gudat, D Pescia, M Landolt Physical review letters 62 (2), 206-209, 1989 | 390 | 1989 |
| Micromachined thermally based CMOS microsensors H Baltes, O Paul, O Brand Proceedings of the IEEE 86 (8), 1660-1678, 1998 | 334 | 1998 |
| Microsystem technology W Menz, J Mohr, O Paul John Wiley & Sons, 2008 | 305 | 2008 |
| MEMS: A practical guide of design, analysis, and applications J Korvink, O Paul Springer Science & Business Media, 2010 | 301 | 2010 |
| Process-dependent thin-film thermal conductivities for thermal CMOS MEMS M Von Arx, O Paul, H Baltes Journal of Microelectromechanical systems 9 (1), 136-145, 2000 | 238 | 2000 |
| GaN-based micro-LED arrays on flexible substrates for optical cochlear implants C Goßler, C Bierbrauer, R Moser, M Kunzer, K Holc, W Pletschen, ... Journal of Physics D: Applied Physics 47 (20), 205401, 2014 | 209 | 2014 |
| Fabrication technology for silicon-based microprobe arrays used in acute and sub-chronic neural recording S Herwik, S Kisban, AAA Aarts, K Seidl, G Girardeau, K Benchenane, ... Journal of Micromechanics and Microengineering 19 (7), 074008, 2009 | 142 | 2009 |
| Multifunctional ZnO‐nanowire‐based sensor A Menzel, K Subannajui, F Güder, D Moser, O Paul, M Zacharias Advanced Functional Materials 21 (22), 4342-4348, 2011 | 134 | 2011 |
| Mechanical properties of thin films from the load deflection of long clamped plates V Ziebart, O Paul, U Munch, J Schwizer, H Baltes Journal of Microelectromechanical Systems 7 (3), 320-328, 1998 | 131 | 1998 |
| Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array A Schaufelbuhl, N Schneeberger, U Munch, M Waelti, O Paul, O Brand, ... Journal of Microelectromechanical systems 10 (4), 503-510, 2001 | 116 | 2001 |
| Strongly buckled square micromachined membranes V Ziebart, O Paul, H Baltes Journal of Microelectromechanical Systems 8 (4), 423-432, 1999 | 101 | 1999 |
| Impeded thermal transport in Si multiscale hierarchical architectures with phononic crystal nanostructures M Nomura, Y Kage, J Nakagawa, T Hori, J Maire, J Shiomi, R Anufriev, ... Physical Review B 91 (20), 205422, 2015 | 99 | 2015 |
| CMOS-based high-density silicon microprobe arrays for electronic depth control in intracortical neural recording K Seidl, S Herwik, T Torfs, HP Neves, O Paul, P Ruther Journal of Microelectromechanical Systems 20 (6), 1439-1448, 2011 | 96 | 2011 |
| High-density μLED-based optical cochlear implant with improved thermomechanical behavior E Klein, C Gossler, O Paul, P Ruther Frontiers in neuroscience 12, 659, 2018 | 92 | 2018 |
| Single-chip CMOS anemometer F Mayer, A Haberli, H Jacobs, G Ofner, O Paul, H Baltes International Electron Devices Meeting. IEDM Technical Digest, 895-898, 1997 | 91 | 1997 |
| Recent progress in neural probes using silicon MEMS technology P Ruther, S Herwik, S Kisban, K Seidl, O Paul IEEJ Transactions on electrical and electronic engineering 5 (5), 505-515, 2010 | 87 | 2010 |
| Fully immersible subcortical neural probes with modular architecture and a delta-sigma ADC integrated under each electrode for parallel readout of 144 recording sites D De Dorigo, C Moranz, H Graf, M Marx, D Wendler, B Shui, AS Herbawi, ... IEEE Journal of Solid-State Circuits 53 (11), 3111-3125, 2018 | 85 | 2018 |
| Thermal phonon transport in silicon nanowires and two-dimensional phononic crystal nanostructures M Nomura, J Nakagawa, Y Kage, J Maire, D Moser, O Paul Applied Physics Letters 106 (14), 2015 | 82 | 2015 |
| In-plane silicon probes for simultaneous neural recording and drug delivery K Seidl, S Spieth, S Herwik, J Steigert, R Zengerle, O Paul, P Ruther Journal of Micromechanics and Microengineering 20 (10), 105006, 2010 | 80 | 2010 |
