Segui
Thorsten Lill
Thorsten Lill
Clarycon Nanotechnology Research
Email verificata su claryconresearch.com - Home page
Titolo
Citata da
Citata da
Anno
Overview of atomic layer etching in the semiconductor industry
KJ Kanarik, T Lill, EA Hudson, S Sriraman, S Tan, J Marks, V Vahedi, ...
Journal of Vacuum Science & Technology A 33 (2), 2015
6622015
Method of etching high aspect ratio features in a dielectric layer
JM Kim, KL Doan, L Ling, J Payyapilly, D Shimuzu, SD Nemani, TB Lill
US Patent App. 13/656,578, 2013
4952013
Method for fabricating a gate structure of a field effect transistor
W Liu, TB Lill, DSL Mui, CD Bencher
US Patent 6,924,191, 2005
4622005
High aspect ratio etch with combination mask
J Guha, SK Reddy, K Chattopadhyay, TW Mountsier, A Eppler, T Lill, ...
US Patent 9,018,103, 2015
4212015
Integrating atomic scale processes: ALD (atomic layer deposition) and ale(atomic layer etch)
K Kanarik, J Marks, H Singh, S Tan, A Kabansky, W Yang, T Kim, ...
3652019
Methods of trimming amorphous carbon film for forming ultra thin structures on a substrate
M Shen, DX Ma, WH Yeh, K MacWilliams, W Liu, TB Lill
US Patent App. 12/163,888, 2009
3612009
Internal plasma grid for semiconductor fabrication
H Singh, T Lill, V Vahedi, A Paterson, M Titus, G Kamarthy
2062019
Methodology for in-situ and real-time chamber condition monitoring and process recovery during plasma processing
S Xu, T Lill
US Patent 7,067,432, 2006
1962006
Endpoint detection for semiconductor processes
MN Grimbergen, TB Lill
US Patent 6,081,334, 2000
1832000
Method of making small transistor lengths
TB Lill, J Kretz
US Patent 6,914,009, 2005
1822005
Cobalt etch back
J Yang, B Zhou, M Shen, T Lill, J Hoang
1792018
Pulsed plasma high aspect ratio dielectric process
A Agarwal, KS Collins, S Rauf, K Ramaswamy, TB Lill
US Patent 8,382,999, 2013
1602013
Isotropic atomic layer etch for silicon and germanium oxides
T Lill, IL Berry III, M Shen, AM Schoepp, DJ Hemker
US Patent 9,431,268, 2016
1422016
Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring
KS Collins, DA Buchberger Jr, K Ramaswamy, S Rauf, H Hanawa, JY Sun, ...
1352010
Predicting synergy in atomic layer etching
KJ Kanarik, S Tan, W Yang, T Kim, T Lill, A Kabansky, EA Hudson, T Ohba, ...
Journal of Vacuum Science & Technology A 35 (5), 2017
1232017
Processing technologies for advanced Ge devices
R Loo, AY Hikavyy, L Witters, A Schulze, H Arimura, D Cott, J Mitard, ...
ECS Journal of Solid State Science and Technology 6 (1), P14, 2016
119*2016
ALE smoothness: In and outside semiconductor industry
K Kanarik, S Tan, T Lill, M Shen, Y Pan, J Marks, R Wise
1182019
ALE smoothness: in and outside semiconductor industry
KJ Kanarik, S Tan, TB Lill, M Shen, Y Pan, J Marks, R Wise
US Patent 9,984,858, 2018
1132018
Dry plasma etch method to pattern MRAM stack
Tan, K Samantha, Y Taeseung, M Wenbing, L Jeffrey, Thorsten
US Patent 9,806,252, 2017
1102017
Process for control of the shape of the etch front in the etching of polysilicon
T Lill, M Grimbergen
US Patent 6,074,954, 2000
1102000
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
Articoli 1–20