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- NG Tsz-WaiCity University of Hong KongEmail verificata su cityu.edu.hk
- Lo Ming-FaiCity University of Hong KongEmail verificata su cityu.edu.hk
- Yafei ZhangShanghai jiaotong Univ.Email verificata su sjtu.edu.cn
- Xiao-Ke LiuAssociate Professor at Linköping UniversityEmail verificata su liu.se
- Lin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学微电子学院教授)Email verificata su hfut.edu.cn
- Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionEmail verificata su tx.technion.ac.il
- Ziruo Hong (洪自若)Apple IncEmail verificata su ucla.edu
- Ruiqin ZHANGCity University of Hong KongEmail verificata su cityu.edu.hk
- Dapeng YUProfessor of Condensed Matter Physics and Materials Science, Peking UniversityEmail verificata su pku.edu.cn
- Sui-Dong WangProfessor, Institute of Functional Nano & Soft Materials (FUNSOM),Soochow UniversityEmail verificata su suda.edu.cn
- Yuan YaoInstitute of Physics, Chinese Academy of ScienceEmail verificata su iphy.ac.cn
- Shafiq.ICity University of Hong KongEmail verificata su my.cityu.edu.hk
- W.J. ZhangProfessor of Mechanical Engineering and Biomedical Engineering, University of SaskatchewanEmail verificata su usask.ca
- Zhengwei PanKing Fahd University of Petroleum and Minerals