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Chhandak Mukherjee
Chhandak Mukherjee
Chargé de Rechereche CNRS, IMS Laboratory, University of Bordeaux, France
Email verificata su ims-bordeaux.fr - Home page
Titolo
Citata da
Citata da
Anno
Resistive switching in natural silk fibroin protein‐based bio‐memristors
C Mukherjee, MK Hota, D Naskar, SC Kundu, CK Maiti
physica status solidi (a) 210 (9), 1797-1805, 2013
602013
Strain-engineered mosfets
CK Maiti, TK Maiti
CRC Press, 2012
522012
Reliability-aware circuit design methodology for beyond-5G communication systems
C Mukherjee, B Ardouin, JY Dupuy, V Nodjiadjim, M Riet, T Zimmer, ...
IEEE Transactions on Device and Materials Reliability 17 (3), 490-506, 2017
352017
A large-signal monolayer graphene field-effect transistor compact model for RF-circuit applications
JD Aguirre-Morales, S Frégonèse, C Mukherjee, W Wei, H Happy, ...
IEEE Transactions on Electron Devices 64 (10), 4302-4309, 2017
292017
Hot-carrier degradation in SiGe HBTs: A physical and versatile aging compact model
C Mukherjee, T Jacquet, GG Fischer, T Zimmer, C Maneux
IEEE Transactions on Electron Devices 64 (12), 4861-4867, 2017
272017
An accurate physics-based compact model for dual-gate bilayer graphene FETs
JD Aguirre-Morales, S Frégonèse, C Mukherjee, C Maneux, T Zimmer
IEEE Transactions on Electron Devices 62 (12), 4333-4339, 2015
272015
Versatile compact model for graphene FET targeting reliability-aware circuit design
C Mukherjee, JD Aguirre-Morales, S Fregonese, T Zimmer, C Maneux
IEEE Transactions on Electron Devices 62 (3), 757-763, 2015
272015
Interface Properties of Atomic Layer Deposited TiO2/Al2O3 Films on In0.53Ga0.47As/InP Substrates
C Mukherjee, T Das, C Mahata, CK Maiti, CK Chia, SY Chiam, DZ Chi, ...
ACS Applied Materials & Interfaces 6 (5), 3263-3274, 2014
272014
Scalable compact modeling of III–V DHBTs: Prospective figures of merit toward terahertz operation
C Mukherjee, C Raya, B Ardouin, M Deng, S Fregonese, T Zimmer, ...
IEEE Transactions on Electron Devices 65 (12), 5357-5364, 2018
232018
Nanowires: Recent Advances
X Peng
BoD–Books on Demand, 2012
232012
Compact modeling of 3D vertical junctionless gate-all-around silicon nanowire transistors towards 3D logic design
C Mukherjee, A Poittevin, I O'Connor, G Larrieu, C Maneux
Solid-State Electronics 183, 108125, 2021
212021
Towards monolithic indium phosphide (InP)-based electronic photonic technologies for beyond 5G communication systems
C Mukherjee, M Deng, V Nodjiadjim, M Riet, C Mismer, D Guendouz, ...
Applied Sciences 11 (5), 2393, 2021
192021
Low-frequency noise in advanced SiGe: C HBTs—Part I: Analysis
C Mukherjee, T Jacquet, A Chakravorty, T Zimmer, J Böck, K Aufinger, ...
IEEE Transactions on Electron Devices 63 (9), 3649-3656, 2016
192016
Efficient compact modelling of UTC-photodiode towards terahertz communication system design
C Mukherjee, M Natrella, J Seddon, C Graham, P Mounaix, CC Renaud, ...
Solid-State Electronics 170, 107836, 2020
172020
Argyrophilic nucleolar organiser regions (AgNORs) in breast lesions.
A Dasgupta, RN Ghosh, R Sarkar, RN Laha, TK Ghosh, C Mukherjee
Journal of the Indian Medical Association 95 (9), 492-494, 1997
151997
Modelling of vertical and ferroelectric junctionless technology for efficient 3D neural network compute cube dedicated to embedded artificial intelligence
C Maneux, C Mukherjee, M Deng, M Dubourg, L Réveil, G Bordea, ...
2021 IEEE International Electron Devices Meeting (IEDM), 15.6. 1-15.6. 4, 2021
132021
A physical and versatile aging compact model for hot carrier degradation in SiGe HBTs under dynamic operating conditions
C Mukherjee, F Marc, M Couret, GG Fischer, M Jaoul, D Céli, K Aufinger, ...
Solid-State Electronics 163, 107635, 2020
132020
A multiscale TCAD approach for the simulation of InP DHBTs and the extraction of their transit times
X Wen, C Mukherjee, C Raya, B Ardouin, M Deng, S Fregonese, ...
IEEE Transactions on Electron Devices 66 (12), 5084-5090, 2019
132019
Scalable compact modeling of trap generation near the EB spacer oxide interface in SiGe HBTs
M Couret, M Jaoul, F Marc, C Mukherjee, D Céli, T Zimmer, C Maneux
Solid-State Electronics 169, 107819, 2020
112020
Scalable modeling of thermal impedance in InP DHBTs targeting terahertz applications
C Mukherjee, M Couret, V Nodjiadjim, M Riet, JY Dupuy, S Fregonese, ...
IEEE Transactions on Electron Devices 66 (5), 2125-2131, 2019
112019
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
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