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Yongfeng MeiFudan UniversityEmail verificata su fudan.edu.cn- GaoShan HuangProfessor, Fudan UniversityEmail verificata su fudan.edu.cn
- David H. GraciasProfessor, Johns Hopkins University; Fellow IEEE, AAAS, APS, AIMBE, RScEmail verificata su jhu.edu
- Wang XiInstitut Jacques Monod, Paris, CNRSEmail verificata su ijm.fr
- Esteban Bermúdez-UreñaVisiting professor, Universidad de Costa RicaEmail verificata su ucr.ac.cr
- Fei DingEmail verificata su umich.edu
- David A. WeitzProfessor of Physics and Applied Physics, Harvard UniversityEmail verificata su seas.harvard.edu
- Paul K ChuChair Professor of Materials Engineering, City University of Hong KongEmail verificata su cityu.edu.hk
- Ricky FuPlasma Technology Limited / City University of Hong KongEmail verificata su cityu.edu.hk
- Martin PumeraProfessor, Head of Future Energy & Innovation Lab, CEITEC Brno; Adv Nanorobots, TU OstravaEmail verificata su ceitec.vutbr.cz
- Carlos Cesar Bof BufonSão Paulo State University (UNESP)Email verificata su unesp.br
- Dr. Elliot J. SmithOptical Physicist, Teledyne ScientificEmail verificata su colorado.edu
- Frank VewingerRheinische Friedrich-Wilhelms-Universität BonnEmail verificata su iap.uni-bonn.de
- Martin WeitzProfessor für Experimentalphysik, Universität BonnEmail verificata su uni-bonn.de
- Lluís SolerDept. of Chemical Engineering, CCEM, INTE, CER-H2, Universitat Politècnica de CatalunyaEmail verificata su upc.edu
- Veronika MagdanzAssistant professor at University of WaterlooEmail verificata su uwaterloo.ca
- Manfred F. MaitzLeibniz Institut für Polymerforschung DresdenEmail verificata su maitz-online.de
- Carlos-Andres PalmaU Strasbourg / MPIP Mainz / TU Munich / HU Berlin / CAS BeijingEmail verificata su mytum.de
- Stefan M. HarazimGLOBALFOUNDRIES Dresden Module One LLC & Co KG
- Vladimir A. Bolaños QuiñonesSemiconductor Industry
