| Microwave acoustic wave devices: Recent advances on architectures, modeling, materials, and packaging A Hagelauer, G Fattinger, CCW Ruppel, M Ueda, K Hashimoto, A Tag IEEE Transactions on Microwave Theory and Techniques 66 (10), 4548-4562, 2018 | 132 | 2018 |
| From microwave acoustic filters to millimeter-wave operation and new applications A Hagelauer, R Ruby, S Inoue, V Plessky, KY Hashimoto, R Nakagawa, ... IEEE Journal of Microwaves 3 (1), 484-508, 2022 | 95 | 2022 |
| Integrated systems-in-package: heterogeneous integration of millimeter-wave active circuits and passives in fan-out wafer-level packaging technologies A Hagelauer, M Wojnowski, K Pressel, R Weigel, D Kissinger IEEE Microwave Magazine 19 (1), 48-56, 2017 | 51 | 2017 |
| Conditional capacity and transmit signal design for SWIPT systems with multiple nonlinear energy harvesting receivers R Morsi, V Jamali, A Hagelauer, DWK Ng, R Schober IEEE Transactions on Communications 68 (1), 582-601, 2019 | 49 | 2019 |
| Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology C Beck, H Ng, R Agethen, M PourMousavi, H Forstner, M Wojnowski, ... IEEE, 2016 | 49 | 2016 |
| Design of a Novel Quarter-Mode Substrate-Integrated Waveguide Filter With Multiple Transmission Zeros and Higher Mode Suppressions XL Huang, L Zhou, M Völkel, A Hagelauer, JF Mao, R Weigel IEEE Transactions on Microwave Theory and Techniques 66 (12), 5573-5584, 2018 | 39 | 2018 |
| A Quad-Core 60 GHz Push-Push 45 nm SOI CMOS VCO with− 101.7 dBc/Hz Phase Noise at 1 MHz offset, 19% Continuous FTR and− 187 dBc/Hz FoMT J Rimmelspacher, R Weigel, A Hagelauer, V Issakov ESSCIRC 2018-IEEE 44th European Solid State Circuits Conference (ESSCIRC …, 2018 | 28 | 2018 |
| Enhancing RF Bulk Acoustic Wave Devices: Multiphysical Modeling and Performance V Chauhan, C Huck, A Frank, W Akstaller, R Weigel, A Hagelauer IEEE Microwave Magazine 20 (10), 56-70, 2019 | 22 | 2019 |
| A 1.8-mW low power, PVT-resilient, high linearity, modified Gilbert-cell down-conversion mixer in 28-nm CMOS R Ciocoveanu, J Rimmelspacher, R Weigel, A Hagelauer, V Issakov 2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2018 | 21 | 2018 |
| A low-power wideband D-band LNA in a 130 nm BiCMOS technology for imaging applications E Aguilar, A Hagelauer, D Kissinger, R Weigel 2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2018 | 21 | 2018 |
| A method for accurate modeling of BAW filters at high power levels A Tag, V Chauhan, C Huck, B Bader, D Karolewski, FM Pitschi, R Weigel, ... IEEE transactions on ultrasonics, ferroelectrics, and frequency control 63 …, 2016 | 21 | 2016 |
| Enhanced Piezoelectric AL1− XSCXN RF-MEMS Resonators for Sub-6 GHz RF-Filter Applications: Design, Fabrication and Characterization A Bogner, R Bauder, HJ Timme, T Forster, C Reccius, R Weigel, ... | 19 | 2020 |
| Impact Of High Sc Content On Crystal Morphology And RF Performance Of Sputtered Al1-xScxN SMR BAW A Bogner, HJ Timme, R Bauder, A Mutzbauer, D Pichler, M Krenzer, ... 2019 IEEE International Ultrasonics Symposium (IUS), 706-709, 2019 | 19 | 2019 |
| Co-simulation and co-design of chip-package-board interfaces in highly-integrated RF systems V Issakov, M Wojnowski, H Knapp, S Trotta, HP Forstner, K Pressel, ... 2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 94-101, 2016 | 19 | 2016 |
| 36% Frequency-tuning-range dual-core 60 GHz push-push VCO in 45 nm RF-SOI CMOS technology J Rimmelspacher, R Weigel, A Hagelauer, V Issakov 2017 IEEE MTT-S International Microwave Symposium (IMS), 1356-1358, 2017 | 17 | 2017 |
| Influence of temperature distribution on behavior, modeling, and reliability of BAW resonators A Tag, R Weigel, A Hagelauer, B Bader, C Huck, M Pitschi, K Wagner, ... 2014 IEEE International Reliability Physics Symposium, 5C. 5.1-5C. 5.7, 2014 | 17 | 2014 |
| 3D rectangular waveguide integrated in embedded wafer level ball grid array (eWLB) package E Seler, M Wojnowski, W Hartner, J Böck, R Lachner, R Weigel, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 956-962, 2014 | 17 | 2014 |
| SAW and CMOS RFID transponder-based wireless systems and their applications A Hagelauer, T Ussmueller, R Weigel 2012 IEEE International Frequency Control Symposium Proceedings, 1-6, 2012 | 17 | 2012 |
| A 52-to-67 GHz dual-core push–push VCO in 40-nm CMOS V Issakov, J Rimmelspacher, S Trotta, M Tiebout, A Hagelauer, R Weigel International Journal of Microwave and Wireless Technologies 10 (7), 783-793, 2018 | 16 | 2018 |
| The impact of embedded wafer level BGA package on the antenna performance M PourMousavi, M Wojnowski, R Agethen, R Weigel, A Hagelauer 2013 IEEE-APS Topical Conference on Antennas and Propagation in Wireless …, 2013 | 16 | 2013 |
