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- Gerhard KlimeckProfessor of Electrical and Computer Engineering, Purdue UniversityEmail verificata su purdue.edu
- Michael PovolotskyiJacobs TechnologiesEmail verificata su jacobs.com
- James CharlesPurdue UniversityEmail verificata su purdue.edu
- Yaohua TanUniversity of VirginiaEmail verificata su purdue.edu
- Prasad SarangapaniRigetti Computing Inc.Email verificata su rigetti.com
- Zhengping JiangSamsung Semiconductor Inc.Email verificata su samsung.com
- Yu HeSynopsys Inc.Email verificata su SYNOPSYS.COM
- Timothy BoykinUniversity of Alabama in HuntsvilleEmail verificata su uah.edu
- James E FonsecaPurdue UniversityEmail verificata su purdue.edu
- Christoph DeutschVienna University of TechnologyEmail verificata su tuwien.ac.at
- Saumitra MehrotraNXP SemiconductorsEmail verificata su nxp.com
- Ganesh HegdeAdvanced Logic Lab, Samsung Semiconductor IncEmail verificata su ssi.samsung.com
- Mark J.W. RodwellProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraEmail verificata su ece.ucsb.edu
- Christian JirauschekProfessor für Elektrotechnik und Informationstechnik, Technische Universität MünchenEmail verificata su tum.de
- Dr. Stefan Birnernextnano GmbH, GermanyEmail verificata su nextnano.com
- Gottfried StrasserProfessor Materials Engineering for Nanoelectronics, TU WienEmail verificata su tuwien.ac.at
- Aaron Maxwell AndrewsTU WienEmail verificata su tuwien.ac.at
- Timothy S FisherMechanical & Aerospace Engineering, University of California Los AngelesEmail verificata su g.ucla.edu
- Kai MiaoPurdue UniversityEmail verificata su purdue.edu
- Kazuhiko HirakawaUniversity of TokyoEmail verificata su iis.u-tokyo.ac.jp