Peter Elenius

Peter Elenius

Managing Partner, E&G Technology Partners
Email verificata su egtechpartners.com
Citato da 1978
semiconductor packaging flip chip WLP wafer level packaging electromigration
Hui XU

Hui XU

Principle Engineer and Team Lead
Email verificata su kns.com
Citato da 1228
Wire bond advanced packaging including Flip chip TCB WLP
Rozalia Beica

Rozalia Beica

CTO at Yole Developpement
Email verificata su yole.fr
Citato da 1029
Semiconductors Advanced Packaging 3DIC 3D Integrations WLP
Junwon Han

Junwon Han

IBM, Samsung electronics, Rensselaer Polytechnic Institute
Email verificata su ibm.com
Citato da 519
semiconductor materials WLP CIS
Hsiu-Ping Wei

Hsiu-Ping Wei

Department of Mechanical Engineering, University of Maryland
Email verificata su umd.edu
Citato da 195
Probabilisitc modeling Uncertainty Propagation Electronic Packaging FEM WLP