Amit Kumar

Amit Kumar

UCF, BRIDG, BSI
Email verificata su brewerscience.com
Citato da 18986
Advanced 3D Integration Wafer Level Packaging Sensors
Frank Niklaus

Frank Niklaus

Professor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm …
Email verificata su kth.se
Citato da 9404
MEMS NEMS Wafer Bonding Wafer-Level Packaging Micro 3D Printing
Robert Hahn

Robert Hahn

Fraunhofer IZM
Email verificata su izm.fraunhofer.de
Citato da 3115
micro batteries wafer level packaging fuel cell autarkic sensors
Peter Elenius

Peter Elenius

Managing Partner, E&G Technology Partners
Email verificata su egtechpartners.com
Citato da 1978
semiconductor packaging flip chip WLP wafer level packaging electromigration
Jeffrey T Wetzel

Jeffrey T Wetzel

L3Harris
Email verificata su l3harris.com
Citato da 1936
Materials Science Silicon Microelectronics MEMS Silicon Photonics Wafer Level Packaging
Marian Bartek

Marian Bartek

assistant professor, Delft University of Technology
Email verificata su tudelft.nl
Citato da 1862
MEMS wafer level packaging flexible electronics stretchable electronics functional electrical stimulation
Viorel Dragoi

Viorel Dragoi

EV Group
Email verificata su aon.at
Citato da 1422
wafer bonding MEMS 3D integration wafer-level packaging
Jie Huang

Jie Huang

Texas Instruments
Email verificata su ti.com
Citato da 1015
Materials Science Nanotechnology Semiconductor Processing Wafer Level Packaging
Alan Huffman

Alan Huffman

SkyWater Technology: Sr. Director - Heterogenous Integration Business Unit
Email verificata su skywatertechnology.com
Citato da 720
wafer level packaging heterogeneous integration FOWLP hybrid bonding interposers
Ali Tavassolizadeh

Ali Tavassolizadeh

Project Manager MEMS
Citato da 668
magnetic field and strain sensors MEMS devices self-sensing microcantilever MR sensors Wafer Level Packaging
1 - 10