Matthew Thorum

Matthew Thorum

Micron Technology
Email verificata su micron.com
Citato da 2020
Electrodeposition Electrocatalysis TSV Advanced Packaging
Sanming Hu

Sanming Hu

Professor, Southeast University, Nanjing, China
Citato da 1902
Antennas Integrated Circuits Millimeter-wave/THz TSV 5G/6G
Olugbenga Famodu

Olugbenga Famodu

GLOBALFOUNDRIES US Inc.
Email verificata su globalfoundries.com
Citato da 1468
Thin Films Electronic Materials and Packaging TSV MEMS Combinatorial Synthesis
Premachandran Chirayarikathuveedu (C S Premachandran)

Premachandran Chirayarikathuveedu (CS Premachandran)

GLOBALFOUNDRIES US Inc.
Email verificata su globalfoundries.com
Citato da 1457
MEMS TSV CPI Packaging 3DIC
Aditya Kumar

Aditya Kumar

GLOBALFOUNDRIES US Inc.
Email verificata su globalfoundries.com
Citato da 1285
Thin Films Electronic Materials and Packaging TSV MEMS
Tapobrata Bandyopadhyay

Tapobrata Bandyopadhyay

Electrical Design Engineer, Texas Instruments
Email verificata su ti.com
Citato da 1236
Signal Integrity Power Integrity 3D Interposer Packaging TSV.
Steve Groothuis

Steve Groothuis

Ayar Labs, Incorporated
Email verificata su ayarlabs.com
Citato da 1203
Package Technology silicon photonics TSV Interposers
Vijay Sukumaran

Vijay Sukumaran

Senior R&D Engineer, PsiQuantum
Email verificata su psiquantum.com
Citato da 1100
Semiconductors Advanced IC packaging Glass interposer Packaging TSV
Simon J. Bleiker

Simon J. Bleiker

PhD Student in Micro and Nanosystmes, KTH Royal Institute of Technology
Email verificata su kth.se
Citato da 888
MEMS NEMS Nano Switch TSV electromechanical computing
Naoya WATANABE

Naoya WATANABE

National Institute of Advanced Industrial Science and Technology (AIST)
Email verificata su aist.go.jp
Citato da 861
TSV bump bonding 3D IC
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