Shang Y. Hou 侯上勇

Shang Y. Hou 侯上勇

台灣積體電路有限公司
Email verificata su ms9.hinet.net
Citato da 12802
Semiconductor packaging 3DIC
Hak-Sung Kim

Hak-Sung Kim

Mechanical Engineering, Hanyang University
Email verificata su hanyang.ac.kr
Citato da 8822
Composite Printed electronics Light sintering technology Semiconductor packaging Nanocomposite
Niranjan Parab

Niranjan Parab

Intel corp.
Email verificata su intel.com
Citato da 5798
Additive manufacturing Dynamic behavior of materials Brittle fracture Laser powder bed fusion semiconductor packaging
Michael Mack

Michael Mack

Luxtera, Inc.
Email verificata su luxtera.com
Citato da 5233
Photonics LEDs Lasers Semiconductor Packaging
Le Cai (蔡乐)

Le Cai (蔡乐)

Meta Reality Labs-Research
Email verificata su meta.com
Citato da 5073
TFT Flexible/Stretchable Hybrid Electronics Micro/Nano Fab Semiconductor Packaging
shintaro yamamichi

shintaro yamamichi

IBM Research -Tokyo
Email verificata su jp.ibm.com
Citato da 4047
Semiconductor packaging AI Hardware Quantum Material Informatics
Bharathi M S

Bharathi MS

Institute of High Performance Computing
Email verificata su ihpc.a-star.edu.sg
Citato da 3249
Thin film growth growth of 2D materials Semiconductor Packaging Nonlinear dynamics Multiscale Modeling
Yonghao Xiu

Yonghao Xiu

Apple
Email verificata su apple.com
Citato da 3188
Polymer Surface physics Optical devices Semiconductor packaging
Stephanie Butler

Stephanie Butler

Technology Innovation Architect
Email verificata su wattsbutler.com
Citato da 2857
power semiconductors advanced process control semiconductor packaging wide bandgap
Ashutosh Jain

Ashutosh Jain

WesternDigital
Email verificata su wdc.com
Citato da 2768
Semiconductor Packaging Materials Science Device Reliability
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