| Location-related thermal history, microstructure, and mechanical properties of arc additively manufactured 2Cr13 steel using cold metal transfer welding J Ge, J Lin, Y Lei, H Fu Materials Science and Engineering: A 715, 144-153, 2018 | 117 | 2018 |
| Characterization of wire arc additive manufacturing 2Cr13 part: Process stability, microstructural evolution, and tensile properties J Ge, J Lin, Y Chen, Y Lei, H Fu Journal of Alloys and Compounds 748, 911-921, 2018 | 95 | 2018 |
| Microstructural features and compressive properties of SLM Ti6Al4V lattice structures J Ge, J Huang, Y Lei, P O'Reilly, M Ahmed, C Zhang, X Yan, S Yin Surface and Coatings Technology 403, 126419, 2020 | 83 | 2020 |
| Microstructure, interfacial IMC and mechanical properties of Sn–0.7 Cu–xAl (x= 0–0.075) lead-free solder alloy L Yang, Y Zhang, J Dai, Y Jing, J Ge, N Zhang Materials & Design 67, 209-216, 2015 | 79 | 2015 |
| Wire-arc additive manufacturing H13 part: 3D pore distribution, microstructural evolution, and mechanical performances J Ge, T Ma, Y Chen, T Jin, H Fu, R Xiao, Y Lei, J Lin Journal of Alloys and Compounds 783, 145-155, 2019 | 70 | 2019 |
| A spatial periodicity of microstructural evolution and anti-indentation properties of wire-arc additive manufacturing 2Cr13 thin-wall part J Ge, J Lin, H Fu, Y Lei, R Xiao Materials & Design 160, 218-228, 2018 | 54 | 2018 |
| A detailed analysis on the microstructure and compressive properties of selective laser melted Ti6Al4V lattice structures J Ge, X Yan, Y Lei, M Ahmed, P O'Reilly, C Zhang, R Lupoi, S Yin Materials & Design 198, 109292, 2021 | 46 | 2021 |
| Effect of Ca and Sr on the compressive creep behavior of Mg–4Al–RE based magnesium alloys Y Zhang, L Yang, J Dai, J Ge, G Guo, Z Liu Materials & Design 63, 439-445, 2014 | 45 | 2014 |
| Thermal-induced microstructural evolution and defect distribution of wire-arc additive manufacturing 2Cr13 part: Numerical simulation and experimental characterization J Ge, T Ma, W Han, T Yuan, T Jin, H Fu, R Xiao, Y Lei, J Lin Applied Thermal Engineering 163, 114335, 2019 | 40 | 2019 |
| Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder L Yang, J Dai, Y Zhang, Y Jing, J Ge, H Liu Journal of Electronic Materials 44, 2473-2478, 2015 | 40 | 2015 |
| Strength-ductility synergy of CoCrNi medium-entropy alloy processed with laser powder bed fusion J Ge, C Chen, R Zhao, Q Liu, Y Long, J Wang, Z Ren, S Yin Materials & Design 219, 110774, 2022 | 39 | 2022 |
| Observation of in-situ tensile wire-arc additively manufactured 205A aluminum part: 3D pore characteristics and microstructural evolution T Ma, J Ge, Y Chen, T Jin, Y Lei Materials Letters 237, 266-269, 2019 | 35 | 2019 |
| Microstructural and mechanical optimization of selective laser melted Ti6Al4V lattices: Effect of hot isostatic pressing X Yan, S Yue, J Ge, C Chen, R Lupoi, S Yin Journal of Manufacturing Processes 77, 151-162, 2022 | 30 | 2022 |
| Effect of volume energy density on selective laser melting NiTi shape memory alloys: microstructural evolution, mechanical and functional properties J Ge, B Yuan, L Zhao, M Yan, W Chen, L Zhang Journal of materials research and technology 20, 2872-2888, 2022 | 29 | 2022 |
| Metamaterials mapped lightweight structures by principal stress lines and topology optimization: Methodology, additive manufacturing, ductile failure and tests Q Liu, R Xu, Y Zhou, J Ge, S Yuan, Y Long, T Shi Materials & Design 212, 110192, 2021 | 27 | 2021 |
| Microstructural evolution and mechanical characterization of wire arc additively manufactured 2Cr13 thin-wall part J Ge, J Lin, Y Long, Q Liu, L Zhang, W Chen, Y Lei Journal of Materials Research and Technology 13, 1767-1778, 2021 | 25 | 2021 |
| Microstructural optimization and mechanical enhancement of SLM Ti6Al4V TPMS scaffolds through vacuum annealing treatment J Ge, Q Huang, Y Wang, C Zhang, Q Liu, Z Lu, S Yin Journal of Alloys and Compounds 934, 167524, 2023 | 24 | 2023 |
| Effect of BaTiO3 on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder L Yang, J Ge, Y Zhang, J Dai, Y Jing Journal of Materials Science: Materials in Electronics 26, 613-619, 2015 | 22 | 2015 |
| Behavior of Sn-3.0 Ag-0.5 Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere S He, YA Shen, B Xiong, F Huo, J Li, J Ge, Z Pan, W Li, C Hu, ... Journal of Materials Research and Technology 21, 2352-2361, 2022 | 19 | 2022 |
| Electromigration reliability for Al2O3-reinforced Cu/Sn–58Bi/Cu composite solder joints L Yang, J Ge, Y Zhang, J Dai, Y Jing Journal of Materials Science: Materials in Electronics 28, 3004-3012, 2017 | 18 | 2017 |