Ikuti
Sung Kyu Lim
Sung Kyu Lim
Professor, Georgia Institute of Technology
Email yang diverifikasi di ece.gatech.edu - Beranda
Judul
Dikutip oleh
Dikutip oleh
Tahun
3D-MAPS: 3D massively parallel processor with stacked memory
DH Kim, K Athikulwongse, M Healy, M Hossain, M Jung, I Khorosh, ...
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 …, 2012
398*2012
A study of through-silicon-via impact on the 3D stacked IC layout
DH Kim, K Athikulwongse, SK Lim
Proceedings of the 2009 International Conference on Computer-Aided Design …, 2009
3472009
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
M Jung, J Mitra, DZ Pan, SK Lim
Communications of the ACM 57 (1), 107-115, 2014
2352014
Design and CAD methodologies for low power gate-level monolithic 3D ICs
SA Panth, K Samadi, Y Du, SK Lim
Proceedings of the 2014 international symposium on Low power electronics and …, 2014
210*2014
Edge separability-based circuit clustering with application to multilevel circuit partitioning
J Cong, SK Lim
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2004
195*2004
Multiobjective microarchitectural floorplanning for 2-D and 3-D ICs
M Healy, M Vittes, M Ekpanyapong, CS Ballapuram, SK Lim, HHS Lee, ...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2006
186*2006
TSV stress aware timing analysis with applications to 3D-IC layout optimization
J Yang, K Athikulwongse, YJ Lee, SK Lim, DZ Pan
Proceedings of the 47th Design Automation Conference, 803-806, 2010
168*2010
Low-power and reliable clock network design for through-silicon via (TSV) based 3D ICs
X Zhao, J Minz, SK Lim
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2010
164*2010
Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux
YJ Kim, YK Joshi, AG Fedorov, YJ Lee, SK Lim
1462010
Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system
M Cho, C Liu, DH Kim, SK Lim, S Mukhopadhyay
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 694-697, 2010
144*2010
Architecture, chip, and package co-design flow for 2.5 D IC design enabling heterogeneous IP reuse
J Kim, G Murali, H Park, E Qin, H Kwon, V Chaitanya, K Chekuri, N Dasari, ...
Proceedings of the 56th Annual Design Automation Conference 2019, 1-6, 2019
143*2019
3D floorplanning with thermal vias
E Wong, SK Lim
Proceedings of the Design Automation & Test in Europe Conference 1, 1-6, 2006
1372006
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study
K Athikulwongse, A Chakraborty, JS Yang, DZ Pan, SK Lim
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 669-674, 2010
1362010
A design tradeoff study with monolithic 3D integration
C Liu, SK Lim
Thirteenth International Symposium on Quality Electronic Design (ISQED), 529-536, 2012
1292012
Physical design for 3D system on package
SK Lim
IEEE Design & Test of Computers 22 (6), 532-539, 2005
1282005
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
C Liu, T Song, J Cho, J Kim, J Kim, SK Lim
Proceedings of the 48th Design Automation Conference, 783-788, 2011
1252011
Pre-bond testable low-power clock tree design for 3D stacked ICs
X Zhao, DL Lewis, HHS Lee, SK Lim
Proceedings of the 2009 International Conference on Computer-Aided Design …, 2009
122*2009
VLSI placement parameter optimization using deep reinforcement learning
A Agnesina, K Chang, SK Lim
Proceedings of the 39th international conference on computer-aided design, 1-9, 2020
1102020
Multiway partitioning with pairwise movement
J Cong, SK Lim
Proceedings of the 1998 IEEE/ACM international conference on Computer-aided …, 1998
1061998
Fast and accurate analytical modeling of through-silicon-via capacitive coupling
DH Kim, S Mukhopadhyay, SK Lim
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011
1052011
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